TMM-138 Series
Manufacturer: Samtec Inc.
CONN UNSHROUDED HEADER HDR 76 POS 2MM SOLDER ST TOP ENTRY THRU-HOLE BULK
| Part | Number of Rows | Style | Contact Length - Mating | Contact Material | Overall Contact Length | Contact Length - Post | Contact Shape | Number of Positions | Mounting Type | Fastening Type | Connector Type | Contact Finish - Post | Current Rating (Per Contact) | Contact Type | Shrouding | Insulation Height | Insulation Color | Insulation Material | Operating Temperature (Max) | Operating Temperature (Min) | Row Spacing - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish - Mating | Number of Positions Loaded | Termination | Number of Positions Loaded | Material Flammability Rating | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 2 | Board Board or Cable | 0.126 in | Phosphor Bronze | 0.323 in | 0.138 in | Square | 76 | Through Hole | Push-Pull | Header | Tin | 3.2 A | Male Pin | Unshrouded | 0.059 in | Black | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | 0.079 in | 0.079 in | 30 µin | Gold | All | Solder | |||
Samtec Inc. | 1 | Board Board or Cable | 0.126 in | Phosphor Bronze | 0.12 in | Square | 38 | Right Angle Through Hole | Push-Pull | Header | Tin | 3.2 A | Male Pin | Unshrouded | 0.079 in | Black | Liquid Crystal Polymer (LCP) | 105 °C | -55 °C | 0.079 in | Tin | Solder | 37 | ||||||
Samtec Inc. | 2 | Board Board or Cable | 0.157 in | Phosphor Bronze | 0.323 in | 0.106 in | Square | 76 | Through Hole | Push-Pull | Header | Tin | 3.2 A | Male Pin | Unshrouded | 0.059 in | Black | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | 0.079 in | 0.079 in | 30 µin | Gold | All | Solder | |||
Samtec Inc. | 2 | Board Board or Cable | 0.126 in | Phosphor Bronze | Square | 76 | Surface Mount | Push-Pull | Header | Tin | 3.2 A | Male Pin | Unshrouded | 0.059 in | Black | Liquid Crystal Polymer (LCP) | 105 °C | -55 °C | 0.079 in | 0.079 in | Tin | All | Solder | UL94 V-0 | |||||
Samtec Inc. | 4 | Board Board or Cable | 0.126 in | Phosphor Bronze | 0.12 in | Square | 152 | Right Angle Through Hole | Push-Pull | Header | Tin | 3.2 A | Male Pin | Unshrouded | 0.315 in | Black | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | 0.079 in | 0.079 in | 30 µin | Gold | All | Solder | ||||
Samtec Inc. | 2 | Board Board or Cable | 0.126 in | Phosphor Bronze | 0.12 in | Square | 76 | Right Angle Through Hole | Push-Pull | Header | Tin | 3.2 A | Male Pin | Unshrouded | 0.155 in | Black | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | 0.079 in | 0.079 in | 10 µin | Gold | Solder | 75 | ||||
Samtec Inc. | 4 | Board Board or Cable | 0.126 in | Phosphor Bronze | 0.323 in | 0.138 in | Square | 152 | Through Hole | Push-Pull | Header | Tin | 3.2 A | Male Pin | Unshrouded | 0.059 in | Black | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | 0.079 in | 0.079 in | 10 µin | Gold | All | Solder | |||
Samtec Inc. | 1 | Board Board or Cable | 0.126 in | Phosphor Bronze | Square | 38 | Surface Mount | Push-Pull | Header | Tin | 3.2 A | Male Pin | Unshrouded | 0.059 in | Black | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | 0.079 in | 30 µin | Gold | All | Solder | UL94 V-0 | |||||
Samtec Inc. | 1 | Board Board or Cable | 0.126 in | Phosphor Bronze | Square | 38 | Surface Mount | Push-Pull | Header | Tin | 3.2 A | Male Pin | Unshrouded | 0.059 in | Black | Liquid Crystal Polymer (LCP) | 105 °C | -55 °C | 0.079 in | Tin | All | Solder | UL94 V-0 | ||||||
Samtec Inc. | 1 | Board Board or Cable | 0.126 in | Phosphor Bronze | Square | 38 | Surface Mount | Push-Pull | Header | Gold | 3.2 A | Male Pin | Unshrouded | 0.059 in | Black | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | 0.079 in | 20 Ąin | Gold | All | Solder | UL94 V-0 | 3 µin |