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CONN IC DIP SOCKET 26POS GOLD
| Part | Contact Material - Mating | Mounting Type | Features | Pitch - Mating | Pitch - Mating | Pitch - Post | Pitch - Post | Current Rating (Amps) | Material Flammability Rating | Type | Type | Type | Housing Material | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination Post Length | Termination Post Length | Operating Temperature [Max] | Operating Temperature [Min] | Contact Material - Post [custom] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Mating | Termination |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Beryllium Copper | Through Hole | Closed Frame Elevated | 0.1 in | 2.54 mm | 2.54 mm | 0.1 in | 3 A | UL94 V-0 | 0.3 " | 7.62 mm | DIP | Glass Filled Nylon 4/6 Polyamide (PA46) | Gold | 30 Áin | 0.76 Ám | 3.56 mm | 0.14 in | 105 ░C | -55 °C | Brass | 10 çin | 0.25 çm | Gold | Solder |