28-6574 Series

Catalog

CONN IC DIP SOCKET ZIF 28POS TIN

Part	Contact Finish - Post	Pitch - Post	Pitch - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Features	Material Flammability Rating	Termination	Mounting Type	Number of Positions or Pins (Grid)	Termination Post Length	Termination Post Length	Contact Material - Post	Type	Type	Type
Aries Electronics 28-6574-18	Tin	2.54 mm	0.1 in	200 µin	5.08 µm	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	Beryllium Copper	1 A	5.08 µm	200 µin	Closed Frame	UL94 V-0	Solder	Through Hole	28	0.11 in	2.78 mm	Beryllium Copper	15.24 mm	DIP ZIF (ZIP)	0.6 "
Aries Electronics 28-6574-11	Tin	2.54 mm	0.1 in	200 µin	5.08 µm	Polyphenylene Sulfide (PPS) Glass Filled	0.1 in	2.54 mm	Beryllium Copper	1 A	5.08 µm	200 µin	Closed Frame	UL94 V-0	Solder	Through Hole	28	0.11 in	2.78 mm	Beryllium Copper	15.24 mm	DIP ZIF (ZIP)	0.6 "