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CONN IC DIP SOCKET 14POS GOLD
| Part | Housing Material | Type | Type | Type | Pitch - Post | Pitch - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Termination Post Length | Termination Post Length | Contact Material - Post [custom] | Contact Finish - Post | Current Rating (Amps) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) | Mounting Type | Pitch - Mating | Pitch - Mating | Material Flammability Rating | Operating Temperature [Max] | Operating Temperature [Min] | Contact Material - Mating | Contact Finish - Mating | Termination | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Glass Filled Nylon 4/6 Polyamide (PA46) | 0.3 " | 7.62 mm | DIP | 2.54 mm | 0.1 in | 30 Áin | 0.76 Ám | Closed Frame Elevated | 3.56 mm | 0.14 in | Brass | Gold | 3 A | 10 çin | 0.25 çm | 14 | Through Hole | 0.1 in | 2.54 mm | UL94 V-0 | 105 ░C | -55 °C | Beryllium Copper | Gold | Solder | |
Aries Electronics | Glass Filled Nylon 4/6 Polyamide (PA46) | 0.3 " | 7.62 mm | DIP | 2.54 mm | 0.1 in | 200 µin | 5.08 µm | Closed Frame Elevated | 3.56 mm | 0.14 in | Tin | 1 A | 200 µin | 5.08 µm | 14 | Through Hole | 0.1 in | 2.54 mm | UL94 V-0 | 105 ░C | -55 °C | Phosphor Bronze | Solder | Phosphor Bronze |