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CONN IC DIP SOCKET 24POS GOLD
| Part | Current Rating (Amps) | Contact Material - Post [custom] | Type | Type | Type | Termination Post Length | Termination Post Length | Operating Temperature [Max] | Operating Temperature [Min] | Contact Material - Mating | Contact Finish - Post | Material Flammability Rating | Pitch - Post | Pitch - Post | Housing Material | Contact Finish - Mating | Termination | Number of Positions or Pins (Grid) | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Features | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 3 A | Brass | 0.3 " | 7.62 mm | DIP | 3.18 mm | 0.125 in | 105 ░C | -55 °C | Beryllium Copper | Tin | UL94 V-0 | 2.54 mm | 0.1 in | Glass Filled Nylon 4/6 Polyamide (PA46) | Gold | Solder | 24 | 0.1 in | 2.54 mm | 10 çin | 0.25 çm | Through Hole | Closed Frame | 200 µin | 5.08 µm |
Aries Electronics | 3 A | Brass | 0.3 " | 7.62 mm | DIP | 3.18 mm | 0.125 in | 105 ░C | -55 °C | Beryllium Copper | Tin | UL94 V-0 | 2.54 mm | 0.1 in | Glass Filled Nylon 4/6 Polyamide (PA46) | Gold | Solder | 24 | 0.1 in | 2.54 mm | 10 çin | 0.25 çm | Through Hole | Closed Frame | 200 µin | 5.08 µm |
Aries Electronics | 3 A | Brass | 0.3 " | 7.62 mm | DIP | 3.18 mm | 0.125 in | 105 ░C | -55 °C | Beryllium Copper | Tin | UL94 V-0 | 2.54 mm | 0.1 in | Glass Filled Nylon 4/6 Polyamide (PA46) | Gold | Solder | 24 | 0.1 in | 2.54 mm | 10 çin | 0.25 çm | Through Hole | Closed Frame | 200 µin | 5.08 µm |