32-3570 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS TIN

Part	Mounting Type	Current Rating (Amps)	Termination Post Length	Termination Post Length	Pitch - Mating	Pitch - Mating	Features	Contact Material - Mating	Pitch - Post	Pitch - Post	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Housing Material	Termination	Contact Material - Post	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Material Flammability Rating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Type	Type	Type	Contact Finish - Mating
Aries Electronics 32-3570-10	Through Hole	1 A	0.11 in	2.78 mm	0.1 in	2.54 mm	Closed Frame	Beryllium Copper	2.54 mm	0.1 in	2 x 16	32	Polyphenylene Sulfide (PPS) Glass Filled	Solder	Beryllium Copper	Tin	5.08 µm	200 µin	UL94 V-0	200 µin	5.08 µm	7.62 mm	0.3 in	DIP ZIF (ZIP)
Aries Electronics 32-3570-16	Through Hole	1 A	0.11 in	2.78 mm	0.1 in	2.54 mm	Closed Frame	Beryllium Nickel	2.54 mm	0.1 in	2 x 16	32	Polyphenylene Sulfide (PPS) Glass Filled	Solder	Beryllium Nickel	Nickel Boron	1.27 µm	50 µin	UL94 V-0	50 µin	1.27 µm	7.62 mm	0.3 in	DIP ZIF (ZIP)	Nickel Boron