32-3570 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS GLD

Part	Current Rating	Material Flammability Rating	Termination Post Length	Contact Finish - Post	Contact Finish Thickness - Post	Row Spacing	Type	Termination	Pitch - Mating	Mounting Type	Features	Contact Finish Thickness - Mating	Contact Material - Post	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Housing Material	Pitch - Post	Contact Material - Mating	Contact Finish - Mating
Aries Electronics 32-3570-11	1 A	UL94 V-0	0.11 in	Gold	10 µin	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Solder	0.1 in	Through Hole	Closed Frame	10 µin	Beryllium Copper	16	32	2	Glass Filled Polyphenylene Sulfide PPS	0.1 in	Beryllium Copper	Gold
Aries Electronics 32-3570-10	1 A	UL94 V-0	0.11 in	Tin	200 µin	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Solder	0.1 in	Through Hole	Closed Frame	200 Ąin	Beryllium Copper	16	32	2	Glass Filled Polyphenylene Sulfide PPS	0.1 in	Beryllium Copper	Tin