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CONN IC DIP SOCKET 12POS GOLD
| Part | Mounting Type | Contact Material - Mating | Current Rating (Amps) | Material Flammability Rating | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) | Contact Finish - Post | Features | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Mating | Termination | Type | Type | Type | Contact Material - Post [custom] | Termination Post Length | Termination Post Length | Pitch - Post | Pitch - Post | Housing Material | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Through Hole | Beryllium Copper | 3 A | UL94 V-0 | 0.1 in | 2.54 mm | 2 6 12 | Gold | Closed Frame Elevated | 105 ░C | -55 °C | 30 Áin | 0.76 Ám | Gold | Solder | 0.3 " | 7.62 mm | DIP | Brass | 3.56 mm | 0.14 in | 2.54 mm | 0.1 in | Glass Filled Nylon 4/6 Polyamide (PA46) | 10 çin | 0.25 çm |