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CONN IC DIP SOCKET ZIF 32POS GLD
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Type | Type | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Current Rating (Amps) | Features | Housing Material | Mounting Type | Contact Finish - Mating | Pitch - Post | Pitch - Post | Termination | Material Flammability Rating | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Termination Post Length | Termination Post Length | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 10 çin | 0.25 çm | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Gold | 0.1 in | 2.54 mm | 1 A | Closed Frame | Polyphenylene Sulfide (PPS) Glass Filled | Through Hole | Gold | 2.54 mm | 0.1 in | Solder | UL94 V-0 | 2 x 16 | 32 | 0.11 in | 2.78 mm | Beryllium Copper | 10 çin | 0.25 çm | Beryllium Copper |