TFM-116 Series

Catalog

CONN HEADER SMD 16POS 1.27MM

Part	Insulation Height	Insulation Height	Insulation Material	Contact Finish - Mating	Current Rating (Amps)	Number of Positions	Contact Type	Mounting Type	Contact Length - Mating	Contact Length - Mating	Contact Shape	Style	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Fastening Type	Contact Material	Number of Positions Loaded	Shrouding	Number of Rows	Connector Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Voltage Rating	Insulation Color	Material Flammability Rating	Operating Temperature [Min]	Operating Temperature [Max]	Termination	Row Spacing - Mating	Row Spacing - Mating	Contact Length - Post [x]	Contact Length - Post [x]	Contact Length - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Features
Samtec Inc. TFM-116-02-L-S	5.6 mm	0.22 in	Liquid Crystal Polymer (LCP)	Gold	2.9 A	16	Male Pin	Surface Mount	3.33 mm	0.131 in	Square	Board to Board Cable	0.05 in	1.27 mm	Tin	Push-Pull	Phosphor Bronze	All	Shrouded - 4 Wall	1	Header	15 µin	0.38 µm	275 VAC	Black	UL94 V-0	-55 °C	125 °C	Solder
Samtec Inc. TFM-116-01-L-D	5.6 mm	0.22 in	Liquid Crystal Polymer (LCP)	Gold	2.9 A		Male Pin	Through Hole	3.33 mm	0.131 in	Square	Board to Board Cable	0.05 in	1.27 mm	Tin	Push-Pull	Phosphor Bronze	All	Shrouded - 4 Wall	2	Header	15 µin	0.38 µm	275 VAC	Black	UL94 V-0	-55 °C	125 °C	Solder	0.05 in	1.27 mm	0.078 in	1.98 mm
Samtec Inc. TFM-116-01-H-D-RA	5.72 mm	0.225 in	Liquid Crystal Polymer (LCP)	Gold	2.9 A		Male Pin	Through Hole Right Angle	3.61 mm	0.142 in	Square	Board to Board Cable	0.05 in	1.27 mm	Gold	Push-Pull	Phosphor Bronze	All	Shrouded - 4 Wall	2	Header	30 Áin	0.76 Ám	275 VAC	Black	UL94 V-0	-55 °C	125 °C	Solder	0.05 in	1.27 mm	0.075 in		1.91 mm	3 µin	0.076 µm
Samtec Inc. TFM-116-12-L-D-A	7.37 mm	0.29 in	Liquid Crystal Polymer (LCP)	Gold	2.9 A		Male Pin	Surface Mount	3.53 mm	0.139 in	Square	Board to Board Cable	0.05 in	1.27 mm	Tin	Push-Pull	Phosphor Bronze	All	Shrouded - 4 Wall	2	Header	15 µin	0.38 µm	275 VAC	Black	UL94 V-0	-55 °C	125 °C	Solder	0.05 in	1.27 mm						Board Guide
Samtec Inc. TFM-116-02-S-D-DS	5.6 mm	0.22 in	Liquid Crystal Polymer (LCP)	Gold	2.9 A		Male Pin	Surface Mount	3.33 mm	0.131 in	Square	Board to Board Cable	0.05 in	1.27 mm	Tin	Push-Pull	Phosphor Bronze	All	Shrouded - 4 Wall	2	Header	30 Áin	0.76 Ám	275 VAC	Black	UL94 V-0	-55 °C	125 °C	Solder	0.05 in	1.27 mm						Mating Flange
Samtec Inc. TFM-116-12-S-D	7.37 mm	0.29 in	Liquid Crystal Polymer (LCP)	Gold	2.9 A		Male Pin	Surface Mount	3.53 mm	0.139 in	Square	Board to Board Cable	0.05 in	1.27 mm	Tin	Push-Pull	Phosphor Bronze	All	Shrouded - 4 Wall	2	Header	30 Áin	0.76 Ám	275 VAC	Black	UL94 V-0	-55 °C	125 °C	Solder	0.05 in	1.27 mm
Samtec Inc. TFM-116-02-L-D	5.6 mm	0.22 in	Liquid Crystal Polymer (LCP)	Gold	2.9 A		Male Pin	Surface Mount	3.33 mm	0.131 in	Square	Board to Board Cable	0.05 in	1.27 mm	Tin	Push-Pull	Phosphor Bronze	All	Shrouded - 4 Wall	2	Header	15 µin	0.38 µm	275 VAC	Black	UL94 V-0	-55 °C	125 °C	Solder	0.05 in	1.27 mm
Samtec Inc. TFM-116-02-L-DH-TR	5.72 mm	0.225 in	Liquid Crystal Polymer (LCP)	Gold	2.9 A		Male Pin	Surface Mount Right Angle	3.81 mm	0.15 in	Square	Board to Board Cable	0.05 in	1.27 mm	Tin	Push-Pull	Phosphor Bronze	All	Shrouded - 4 Wall	2	Header	15 µin	0.38 µm	275 VAC	Black	UL94 V-0	-55 °C	125 °C	Solder	0.05 in	1.27 mm
Samtec Inc. TFM-116-02-S-D-A	5.6 mm	0.22 in	Liquid Crystal Polymer (LCP)	Gold	2.9 A		Male Pin	Surface Mount	3.33 mm	0.131 in	Square	Board to Board Cable	0.05 in	1.27 mm	Tin	Push-Pull	Phosphor Bronze	All	Shrouded - 4 Wall	2	Header	30 Áin	0.76 Ám	275 VAC	Black	UL94 V-0	-55 °C	125 °C	Solder	0.05 in	1.27 mm						Board Guide
Samtec Inc. TFM-116-02-L-D-WT-K-TR	5.6 mm	0.22 in	Liquid Crystal Polymer (LCP)	Gold	2.9 A		Male Pin	Surface Mount	3.33 mm	0.131 in	Square	Board to Board Cable	0.05 in	1.27 mm	Tin	Push-Pull	Phosphor Bronze	All	Shrouded - 4 Wall	2	Header	15 µin	0.38 µm	275 VAC	Black	UL94 V-0	-55 °C	125 °C	Solder	0.05 in	1.27 mm						Pick and Place Solder Retention