CONN SOCKET PGA GOLD
| Part | Current Rating (Amps) | Pitch - Post | Pitch - Post | Termination | Material Flammability Rating | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Mating | Operating Temperature [Max] | Operating Temperature [Min] | Mounting Type | Contact Material - Post [custom] | Housing Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Contact Finish - Mating | Termination Post Length | Termination Post Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 3 A | 2.54 mm | 0.1 in | Solder | UL94 V-0 | 0.1 in | 2.54 mm | Tin | 200 µin | 5.08 µm | Beryllium Copper | 105 ░C | -55 °C | Through Hole | Brass | Glass Filled Nylon 4/6 Polyamide (PA46) | 10 çin | 0.25 çm | PGA | Gold | 0.165 in | 4.19 mm |
Aries Electronics | 3 A | 2.54 mm | 0.1 in | Solder | UL94 V-0 | 0.1 in | 2.54 mm | Tin | 200 µin | 5.08 µm | Beryllium Copper | 105 ░C | -55 °C | Through Hole | Brass | Glass Filled Nylon 4/6 Polyamide (PA46) | 10 çin | 0.25 çm | PGA | Gold | 0.165 in | 4.19 mm |
Aries Electronics | 3 A | 2.54 mm | 0.1 in | Solder | UL94 V-0 | 0.1 in | 2.54 mm | Tin | 200 µin | 5.08 µm | Beryllium Copper | 105 ░C | -55 °C | Through Hole | Brass | Glass Filled Nylon 4/6 Polyamide (PA46) | 10 çin | 0.25 çm | PGA | Gold | 0.165 in | 4.19 mm |
Aries Electronics | 3 A | 2.54 mm | 0.1 in | Solder | UL94 V-0 | 0.1 in | 2.54 mm | Tin | 200 µin | 5.08 µm | Beryllium Copper | 105 ░C | -55 °C | Through Hole | Brass | Glass Filled Nylon 4/6 Polyamide (PA46) | 10 çin | 0.25 çm | PGA | Gold | 0.165 in | 4.19 mm |