TSM-140 Series

Catalog

CONN HEADER SMD 80POS 2.54MM

Part	Style	Fastening Type	Contact Finish - Post	Insulation Material	Mounting Type	Operating Temperature [Min]	Operating Temperature [Max]	Insulation Height	Insulation Height	Contact Type	Connector Type	Contact Length - Mating	Contact Length - Mating	Contact Finish - Mating	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Contact Shape	Contact Material	Number of Rows	Insulation Color	Features	Termination	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions Loaded	Shrouding	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Number of Positions	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Length - Mating [x]
Samtec Inc. TSM-140-03-L-DV-A	Board to Board Cable	Push-Pull	Tin	Liquid Crystal Polymer (LCP)	Surface Mount	-55 °C	125 °C	0.1 in	2.54 mm	Male Pin	Cuttable Header	0.42 in	10.67 mm	Gold	2.54 mm	0.1 in	Square	Phosphor Bronze	2	Black	Board Guide	Solder	10 çin	0.25 çm	All	Unshrouded	UL94 V-0	0.1 in	2.54 mm	80
Samtec Inc. TSM-140-03-G-DV-A	Board to Board Cable	Push-Pull	Gold	Liquid Crystal Polymer (LCP)	Surface Mount	-55 °C	125 °C	0.1 in	2.54 mm	Male Pin	Cuttable Header	0.42 in	10.67 mm	Gold	2.54 mm	0.1 in	Square	Phosphor Bronze	2	Black	Board Guide	Solder	10 çin	0.25 çm	All	Unshrouded	UL94 V-0	0.1 in	2.54 mm	80	3 µin	0.076 µm
Samtec Inc. TSM-140-01-STL-DV	Board to Board Cable	Push-Pull	Tin	Liquid Crystal Polymer (LCP)	Surface Mount	-55 °C	125 °C	0.1 in	2.54 mm	Male Pin	Cuttable Header		5.84 mm	Gold	2.54 mm	0.1 in	Square	Phosphor Bronze	2	Black		Solder	30 Áin	0.76 Ám	All	Unshrouded	UL94 V-0	0.1 in	2.54 mm	80			0.23 in
Samtec Inc. TSM-140-04-STL-DV	Board to Board Cable	Push-Pull	Tin	Liquid Crystal Polymer (LCP)	Surface Mount	-55 °C	125 °C	0.1 in	2.54 mm	Male Pin	Cuttable Header	0.12 in	3.05 mm	Gold	2.54 mm	0.1 in	Square	Phosphor Bronze	2	Black		Solder	30 Áin	0.76 Ám	All	Unshrouded	UL94 V-0	0.1 in	2.54 mm	80
Samtec Inc. TSM-140-02-F-DV-A	Board to Board Cable	Push-Pull	Tin	Liquid Crystal Polymer (LCP)	Surface Mount	-55 °C	125 °C	0.1 in	2.54 mm	Male Pin	Cuttable Header	0.32 in	8.13 mm	Gold	2.54 mm	0.1 in	Square	Phosphor Bronze	2	Black	Board Guide	Solder	3 µin	0.076 µm	All	Unshrouded	UL94 V-0	0.1 in	2.54 mm	80
Samtec Inc. TSM-140-01-L-DV	Board to Board Cable	Push-Pull	Tin	Liquid Crystal Polymer (LCP)	Surface Mount	-55 °C	125 °C	0.1 in	2.54 mm	Male Pin	Cuttable Header		5.84 mm	Gold	2.54 mm	0.1 in	Square	Phosphor Bronze	2	Black		Solder	10 çin	0.25 çm	All	Unshrouded	UL94 V-0	0.1 in	2.54 mm	80			0.23 in
Samtec Inc. TSM-140-02-S-DV-LC	Board to Board Cable	Push-Pull	Tin	Liquid Crystal Polymer (LCP)	Surface Mount	-55 °C	125 °C	0.1 in	2.54 mm	Male Pin	Cuttable Header	0.32 in	8.13 mm	Gold	2.54 mm	0.1 in	Square	Phosphor Bronze	2	Black		Solder	30 Áin	0.76 Ám	All	Unshrouded	UL94 V-0	0.1 in	2.54 mm	80
Samtec Inc. TSM-140-01-T-DV	Board to Board Cable	Push-Pull	Tin	Liquid Crystal Polymer (LCP)	Surface Mount	-55 °C	105 ░C	0.1 in	2.54 mm	Male Pin	Cuttable Header		5.84 mm		2.54 mm	0.1 in	Square	Phosphor Bronze	2	Black		Solder			All	Unshrouded	UL94 V-0	0.1 in	2.54 mm	80			0.23 in
Samtec Inc. TSM-140-02-STL-DV	Board to Board Cable	Push-Pull	Tin	Liquid Crystal Polymer (LCP)	Surface Mount	-55 °C	125 °C	0.1 in	2.54 mm	Male Pin	Cuttable Header	0.32 in	8.13 mm	Gold	2.54 mm	0.1 in	Square	Phosphor Bronze	2	Black		Solder	30 Áin	0.76 Ám	All	Unshrouded	UL94 V-0	0.1 in	2.54 mm	80
Samtec Inc. TSM-140-04-T-SV-P	Board to Board Cable	Push-Pull	Tin	Liquid Crystal Polymer (LCP)	Surface Mount	-55 °C	105 ░C	0.1 in	2.54 mm	Male Pin	Cuttable Header	0.12 in	3.05 mm				Square	Phosphor Bronze	1	Black	Pick and Place	Solder			All	Unshrouded	UL94 V-0	0.1 in	2.54 mm	40