CONN HEADER R/A 8POS 5.08MM
| Part | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Post | Insulation Material | Pitch - Mating | Pitch - Mating | Contact Finish - Mating | Insulation Height | Insulation Height | Number of Rows | Contact Type | Termination | Contact Length - Mating [x] | Contact Length - Mating | Number of Positions Loaded | Contact Shape | Insulation Color | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Connector Type | Fastening Type | Current Rating (Amps) | Material Flammability Rating | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Style | Mounting Type | Contact Material | Shrouding | Number of Positions | Contact Length - Post | Contact Length - Post | Overall Contact Length | Overall Contact Length | Contact Length - Mating | Contact Length - Post [x] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Length - Post [x] | Contact Length - Mating [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | -55 °C | 125 °C | Tin | Liquid Crystal Polymer (LCP) | 5.08 mm | 0.2 in | Gold | 0.24 in | 6.1 mm | 2 | Male Pin | Solder | 0.23 in | 5.84 mm | All | Square | Natural | 10 çin | 0.25 çm | Header | Push-Pull | Varies by Wire Gauge | UL94 V-0 | 2.54 mm | 0.1 in | Board to Board Cable | Through Hole Right Angle | Phosphor Bronze | Unshrouded | 8 | 0.09 " | 2.29 mm | ||||||||
Samtec Inc. | -55 °C | 125 °C | Tin | Liquid Crystal Polymer (LCP) | 5.08 mm | 0.2 in | Gold | 0.1 in | 2.54 mm | 1 | Male Pin | Solder | 0.23 in | 5.84 mm | All | Square | Natural | 3 µin | 0.076 µm | Header | Push-Pull | Varies by Wire Gauge | UL94 V-0 | Board to Board Cable | Through Hole | Phosphor Bronze | Unshrouded | 4 | 0.1 in | 2.54 mm | 0.43 in | 10.92 mm | ||||||||
Samtec Inc. | -55 °C | 125 °C | Tin | Liquid Crystal Polymer (LCP) | 5.08 mm | 0.2 in | Gold | 0.1 in | 2.54 mm | 2 | Male Pin | Solder | 8.13 mm | All | Square | Natural | 30 Áin | 0.76 Ám | Header | Push-Pull | Varies by Wire Gauge | UL94 V-0 | 2.54 mm | 0.1 in | Board to Board Cable | Through Hole | Phosphor Bronze | Unshrouded | 8 | 2.79 mm | 0.53 in | 13.46 mm | 0.32 in | 0.11 in | ||||||
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Samtec Inc. | -55 °C | 125 °C | Tin | Liquid Crystal Polymer (LCP) | 5.08 mm | 0.2 in | Gold | 0.1 in | 2.54 mm | 1 | Male Pin | Solder | All | Square | Natural | 3 µin | 0.076 µm | Header | Push-Pull | Varies by Wire Gauge | UL94 V-0 | Board to Board Cable | Through Hole | Phosphor Bronze | Unshrouded | 4 | 0.13 in | 3.3 mm | 0.335 in | 8.51 mm | ||||||||||
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Samtec Inc. | -55 °C | 125 °C | Gold | Liquid Crystal Polymer (LCP) | 5.08 mm | 0.2 in | Gold | 0.1 in | 2.54 mm | 1 | Male Pin | Solder | 20.83 mm | All | Square | Natural | 10 çin | 0.25 çm | Header | Push-Pull | Varies by Wire Gauge | UL94 V-0 | Board to Board Cable | Through Hole | Phosphor Bronze | Unshrouded | 4 | 2.79 mm | 1.03 in | 26.16 mm | 0.82 in | 0.11 in | 3 µin | 0.076 µm | ||||||
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Samtec Inc. | -55 °C | 105 ░C | Tin | Liquid Crystal Polymer (LCP) | 5.08 mm | 0.2 in | 0.122 in | 3.1 mm | 1 | Male Pin | Solder | 0.23 in | 5.84 mm | All | Square | Natural | Header | Push-Pull | Varies by Wire Gauge | UL94 V-0 | Board to Board Cable | Through Hole Right Angle | Phosphor Bronze | Unshrouded | 4 | 0.29 " | 7.37 mm | |||||||||||||
Samtec Inc. | -55 °C | 125 °C | Gold | Liquid Crystal Polymer (LCP) | 5.08 mm | 0.2 in | Gold | 0.1 in | 2.54 mm | 1 | Male Pin | Solder | 0.52 in | All | Square | Natural | 10 çin | 0.25 çm | Header | Push-Pull | Varies by Wire Gauge | UL94 V-0 | Board to Board Cable | Through Hole | Phosphor Bronze | Unshrouded | 4 | 2.79 mm | 0.73 in | 18.54 mm | 0.11 in | 3 µin | 0.076 µm | 13.21 mm |