ESS-108 Series

Catalog

CONN SOCKET 8POS 0.1 GOLD PCB

Part	Number of Positions Loaded	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Termination	Operating Temperature [Min]	Operating Temperature [Max]	Contact Type	Material Flammability Rating	Connector Type	Mounting Type	Number of Rows	Contact Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Shape	Number of Positions	Insulation Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Length - Post	Contact Length - Post	Fastening Type	Insulation Height [z]	Insulation Height [z]	Insulation Color	Contact Finish - Mating	Insulation Height	Insulation Height	Contact Length - Post [x]	Contact Length - Post [x]
Samtec Inc. ESS-108-G-08	All	0.1 in	2.54 mm	Gold	Solder	-55 °C	125 °C	Female Socket	UL94 V-0	Elevated Socket	Through Hole	1	Beryllium Copper	10 çin	0.25 çm	Circular	8	Liquid Crystal Polymer (LCP)	10 çin	0.25 çm	9.27 mm	0.365 in	Push-Pull	0.3 in	7.62 mm	Black	Gold
Samtec Inc. ESS-108-T-06	All	0.1 in	2.54 mm	Tin	Solder	-55 °C	125 °C	Female Socket	UL94 V-0	Elevated Socket	Through Hole	1	Beryllium Copper	10 çin	0.25 çm	Circular	8	Liquid Crystal Polymer (LCP)			5.46 mm	0.215 in	Push-Pull	0.3 in	7.62 mm	Black	Gold
Samtec Inc. ESS-108-TT-07	All	0.1 in	2.54 mm	Tin	Solder	-55 °C	125 °C	Female Socket	UL94 V-0	Elevated Socket	Through Hole	1	Beryllium Copper			Circular	8	Liquid Crystal Polymer (LCP)			6.73 mm	0.265 in	Push-Pull			Black		0.4 in	10.16 mm
Samtec Inc. ESS-108-T-04	All	0.1 in	2.54 mm	Tin	Solder	-55 °C	125 °C	Female Socket	UL94 V-0	Elevated Socket	Through Hole	1	Beryllium Copper	10 çin	0.25 çm	Circular	8	Liquid Crystal Polymer (LCP)					Push-Pull			Black	Gold	0.4 in	10.16 mm	3.12 mm	0.123 in
Samtec Inc. ESS-108-TT-08	All	0.1 in	2.54 mm	Tin	Solder	-55 °C	125 °C	Female Socket	UL94 V-0	Elevated Socket	Through Hole	1	Beryllium Copper			Circular	8	Liquid Crystal Polymer (LCP)			9.27 mm	0.365 in	Push-Pull	0.3 in	7.62 mm	Black
Samtec Inc. ESS-108-T-23	All	0.1 in	2.54 mm	Tin	Solder	-55 °C	125 °C	Female Socket	UL94 V-0	Elevated Socket	Through Hole	1	Beryllium Copper	10 çin	0.25 çm	Circular	8	Liquid Crystal Polymer (LCP)					Push-Pull	0.3 in	7.62 mm	Black	Gold			3.12 mm	0.123 in
Samtec Inc. ESS-108-G-05	All	0.1 in	2.54 mm	Gold	Solder	-55 °C	125 °C	Female Socket	UL94 V-0	Elevated Socket	Through Hole	1	Beryllium Copper	10 çin	0.25 çm	Circular	8	Liquid Crystal Polymer (LCP)	10 çin	0.25 çm	4.4 mm	0.173 in	Push-Pull			Black	Gold	0.5 in	12.7 mm
Samtec Inc. ESS-108-T-07	All	0.1 in	2.54 mm	Tin	Solder	-55 °C	125 °C	Female Socket	UL94 V-0	Elevated Socket	Through Hole	1	Beryllium Copper	10 çin	0.25 çm	Circular	8	Liquid Crystal Polymer (LCP)			6.73 mm	0.265 in	Push-Pull			Black	Gold	0.4 in	10.16 mm
Samtec Inc. ESS-108-T-25	All	0.1 in	2.54 mm	Tin	Solder	-55 °C	125 °C	Female Socket	UL94 V-0	Elevated Socket	Through Hole	1	Beryllium Copper	10 çin	0.25 çm	Circular	8	Liquid Crystal Polymer (LCP)			4.4 mm	0.173 in	Push-Pull			Black	Gold	0.5 in	12.7 mm
Samtec Inc. ESS-108-TT-24	All	0.1 in	2.54 mm	Tin	Solder	-55 °C	125 °C	Female Socket	UL94 V-0	Elevated Socket	Through Hole	1	Beryllium Copper			Circular	8	Liquid Crystal Polymer (LCP)					Push-Pull			Black		0.4 in	10.16 mm	3.12 mm	0.123 in