20-6513 Series

Catalog

CONN IC DIP SOCKET 20POS GOLD

Part	Contact Material - Post [custom]	Type	Type	Type	Contact Finish - Post	Pitch - Mating	Pitch - Mating	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Post	Pitch - Post	Housing Material	Features	Termination	Mounting Type	Current Rating (Amps)	Contact Material - Mating	Termination Post Length	Termination Post Length	Operating Temperature [Max]	Operating Temperature [Min]	Contact Finish - Mating	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Aries Electronics 20-6513-11H	Brass	DIP	0.6 in	15.24 mm	Gold	0.1 in	2.54 mm	UL94 V-0	10 çin	0.25 çm	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	Closed Frame	Solder	Through Hole	3 A	Beryllium Copper	3.18 mm	0.125 in	105 ░C	-55 °C	Gold	20	10 çin	0.25 çm
Aries Electronics 20-6513-10H	Brass	DIP	0.6 in	15.24 mm	Tin	0.1 in	2.54 mm	UL94 V-0	10 çin	0.25 çm	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	Closed Frame	Solder	Through Hole	3 A	Beryllium Copper	3.18 mm	0.125 in	105 ░C	-55 °C	Gold	20	200 µin	5.08 µm
Aries Electronics 20-6513-10	Brass	DIP	0.6 in	15.24 mm	Tin	0.1 in	2.54 mm	UL94 V-0	10 çin	0.25 çm	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	Closed Frame	Solder	Through Hole	3 A	Beryllium Copper	3.18 mm	0.125 in			Gold	20	200 µin	5.08 µm
Aries Electronics 20-6513-11	Brass	DIP	0.6 in	15.24 mm	Gold	0.1 in	2.54 mm	UL94 V-0	10 çin	0.25 çm	2.54 mm	0.1 in	Glass Filled Nylon 4/6 Polyamide (PA46)	Closed Frame	Solder	Through Hole	3 A	Beryllium Copper	3.18 mm	0.125 in	105 ░C	-55 °C	Gold	20	10 çin	0.25 çm