W25X20 Series
Manufacturer: Winbond Electronics
IC FLASH 2MBIT SPI 104MHZ 8USON
| Part | Operating Temperature (Max) | Operating Temperature (Min) | Technology | Package / Case | Clock Frequency | Mounting Type | Memory Width | Memory Depth | Write Cycle Time - Page | Write Cycle Time - Word | Memory Type | Voltage - Supply (Maximum) | Voltage - Supply (Minimum) | Memory Format | Package Width | Package Name | Package Length | Memory Interface (Type) | Memory Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | 85 °C | -40 °C | FLASH | 8-UFDFN Exposed Pad | 104 MHz | Surface Mount | 8 bit | 256 K | 800 µs | 800 µs | Non-Volatile | 3.6 V | 2.3 V | FLASH | 3 mm | 8-USON | 2 mm | SPI | 2 Mb |
Winbond Electronics | 85 °C | -40 °C | FLASH | 8-WDFN Exposed Pad | 75 MHz | Surface Mount | 8 bit | 256 K | 3 ms | 3 ms | Non-Volatile | 3.6 V | 2.7 V | FLASH | 5 mm | 8-WSON | 6 mm | SPI | 2 Mb |
Winbond Electronics | 85 °C | -40 °C | FLASH | 104 MHz | Surface Mount | 8 bit | 256 K | 800 µs | 800 µs | Non-Volatile | 3.6 V | 2.3 V | FLASH | 3.9 mm | 8-SOIC | 0.154 in | SPI | 2 Mb | |
Winbond Electronics | 85 °C | -40 °C | FLASH | 104 MHz | Surface Mount | 8 bit | 256 K | 800 µs | 800 µs | Non-Volatile | 3.6 V | 2.3 V | FLASH | 3.9 mm | 8-SOIC 8-VSOP | 0.154 in | SPI | 2 Mb | |
Winbond Electronics | 85 °C | -40 °C | FLASH | 104 MHz | Surface Mount | 8 bit | 256 K | 800 µs | 800 µs | Non-Volatile | 3.6 V | 2.3 V | FLASH | 3.9 mm | 8-SOIC 8-VSOP | 0.154 in | SPI | 2 Mb | |
Winbond Electronics | 85 °C | -40 °C | FLASH | 104 MHz | Surface Mount | 8 bit | 256 K | 800 µs | 800 µs | Non-Volatile | 3.6 V | 2.3 V | FLASH | 3.9 mm | 8-SOIC | 0.154 in | SPI | 2 Mb | |
Winbond Electronics | 85 °C | -40 °C | FLASH | 104 MHz | Surface Mount | 8 bit | 256 K | 3 ms | 3 ms | Non-Volatile | 3.6 V | 2.7 V | FLASH | 3.9 mm | 8-SOIC | 0.154 in | SPI | 2 Mb | |
Winbond Electronics | 85 °C | -40 °C | FLASH | 8-WDFN Exposed Pad | 75 MHz | Surface Mount | 8 bit | 256 K | 3 ms | 3 ms | Non-Volatile | 3.6 V | 2.7 V | FLASH | 5 mm | 8-WSON | 6 mm | SPI | 2 Mb |
Winbond Electronics | 85 °C | -40 °C | FLASH | 8-WDFN Exposed Pad | 104 MHz | Surface Mount | 8 bit | 256 K | 3 ms | 3 ms | Non-Volatile | 3.6 V | 2.7 V | FLASH | 5 mm | 8-WSON | 6 mm | SPI | 2 Mb |
Winbond Electronics | 85 °C | -40 °C | FLASH | 8-WDFN Exposed Pad | 104 MHz | Surface Mount | 8 bit | 256 K | 800 µs | 800 µs | Non-Volatile | 3.6 V | 2.3 V | FLASH | 5 mm | 8-WSON | 6 mm | SPI | 2 Mb |