516 Series

Catalog

CONN IC DIP SOCKET 16POS GOLD

Part	Contact Finish - Mating	Contact Material - Mating	Features	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns	Row Spacing	Type	Termination	Pitch - Post	Housing Material	Mounting Type	Contact Finish Thickness - Mating	Contact Material - Post	Contact Finish Thickness - Post	Contact Finish - Post	Operating Temperature (Max)	Operating Temperature (Min)	Pitch - Mating	Material Flammability Rating	Contact Resistance	Current Rating	Termination Post Length
TE Connectivity AMP Connectors 516-AG11D-ESL	Gold	Beryllium Copper	Closed Frame	2	16	8	0.3 in	0.3" (7.62mm) Row Spacing DIP	Solder	0.1 in	Polyester	Through Hole	5 µin	Beryllium Copper	5 µin	Tin-Lead	125 °C	-55 °C	0.1 in	UL94 V-0	10 mOhm	3 A	0.125 in
TE Connectivity AMP Connectors 516-AG7D	Gold	Copper Alloy	Closed Frame	2	16	8	0.3 in	0.3" (7.62mm) Row Spacing DIP	Solder	0.1 in	Polyester	Through Hole		Copper Alloy		Gold	125 °C	-55 °C	0.1 in	UL94 V-0	10 mOhm	3 A	0.125 in
TE Connectivity AMP Connectors 516-AG11D-ES	Gold	Copper Alloy	Closed Frame	2	16	8	0.3 in	0.3" (7.62mm) Row Spacing DIP	Solder	0.1 in	Polyester	Through Hole		Copper Alloy		Tin-Lead	105 °C	-55 °C	0.1 in	UL94 V-0	10 mOhm	3 A	0.125 in
TE Connectivity AMP Connectors 516-AG10D	Gold	Beryllium Copper	Closed Frame	2	16	8	0.3 in	0.3" (7.62mm) Row Spacing DIP	Solder	0.1 in		Through Hole		Brass			125 °C	-55 °C	0.1 in		10 mOhm		0.125 in