2P SIP GOLD BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS
| Part | Housing Material | Contact Material - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Features | Type | Contact Material - Post [custom] | Mounting Type | Termination Post Length | Termination Post Length | Material Flammability Rating | Termination | Current Rating (Amps) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics 02-0518-10 | Glass Filled, Nylon 4/6, Polyamide (PA46) | Beryllium Copper | 10 çin | 0.25 çm | 200 µin | 5.08 µm | 2.54 mm | 0.1 in | 1 x 2 | 2 | Gold | 0.1 in | 2.54 mm | Tin | Open Frame | SIP | Brass | Through Hole | 3.18 mm | 0.125 in | UL94 V-0 | Solder | 3 A |