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CONN IC DIP SOCKET 38POS GOLD
| Part | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Termination Post Length | Termination Post Length | Termination | Contact Material - Post [custom] | Pitch - Mating | Pitch - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) | Housing Material | Type | Type | Type | Features | Pitch - Post | Pitch - Post | Mounting Type | Material Flammability Rating | Current Rating (Amps) | Contact Finish - Mating | Operating Temperature [Max] | Operating Temperature [Min] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 10 çin | 0.25 çm | 30 Áin | 0.76 Ám | Beryllium Copper | 3.56 mm | 0.14 in | Solder | Brass | 0.1 in | 2.54 mm | Gold | 38 | Glass Filled Nylon 4/6 Polyamide (PA46) | DIP | 0.6 in | 15.24 mm | Closed Frame Elevated | 2.54 mm | 0.1 in | Through Hole | UL94 V-0 | 3 A | Gold | 105 ░C | -55 °C |