APA1000 Series

Ultra Low Density FPGAs

Catalog

Ultra Low Density FPGAs

Part	Total RAM Bits	Number of Gates	Package / Case	Mounting Type	Number of I/O	Voltage - Supply (Maximum)	Voltage - Supply (Minimum)	Operating Temperature (Min)	Operating Temperature (Max)	Package Name	Package Width	Package Length
Microchip Technology APA1000-BG456M	202752 bits	1000000	456-BBGA	Surface Mount	356	2.7 V	2.3 V	-55 °C	125 °C	456-PBGA	35 mm	35 mm
Microchip Technology APA1000-LG624M	202752 bits	1000000	624-BCLGA	Surface Mount	440	2.7 V	2.3 V	-55 °C	125 °C	624-CLGA	32.5 mm	32.5 mm
Microchip Technology APA1000-PQ208A	202752 bits	1000000	208-BFQFP	Surface Mount	158	2.625 V	2.375 V	-40 °C	125 °C	208-PQFP	28 mm	28 mm
Microchip Technology APA1000-PQG208M	202752 bits	1000000	208-BFQFP	Surface Mount	158	2.7 V	2.3 V	-55 °C	125 °C	208-PQFP	28 mm	28 mm
Microchip Technology APA1000-BGG456M	202752 bits	1000000	456-BBGA	Surface Mount	356	2.7 V	2.3 V	-55 °C	125 °C	456-PBGA	35 mm	35 mm
Microchip Technology APA1000-CQ208M	202752 bits	1000000	208-BFCQFP with Tie Bar	Surface Mount	158	2.7 V	2.3 V	-55 °C	125 °C	208-CQFP	75 mm	75 mm
Microchip Technology APA1000-FGG896A	202752 bits	1000000	896-BGA	Surface Mount	642	2.625 V	2.375 V	-40 °C	125 °C	896-FBGA	31 mm	31 mm
Microchip Technology APA1000-CQ208B	202752 bits	1000000	208-BFCQFP with Tie Bar	Surface Mount	158	2.7 V	2.3 V	-55 °C	125 °C	208-CQFP	75 mm	75 mm
Microchip Technology APA1000-CGS624B	202752 bits	1000000	624-BCCGA	Through Hole	440	2.7 V	2.3 V	-55 °C	125 °C	624-CCGA	32.5 mm	32.5 mm
Microchip Technology APA1000-BG456	202752 bits	1000000	456-BBGA	Surface Mount	356	2.7 V	2.3 V	0 °C	70 °C	456-PBGA	35 mm	35 mm

Catalog

Ultra Low Density FPGAs

Description

The ProASICPLUS family of devices, combines the advantages of ASICs with the benefits of programmable devices through nonvolatile flash technology. Key Features • Reprogrammable • Nonvolatile • Live at power-up • ASIC design flow • Very low power • PLLs and LVPECL I/O