HMTSW-115 Series

Catalog

CONN HEADER R/A 30POS 2.54MM

Part	Insulation Color	Insulation Material	Insulation Height	Number of Rows	Contact Finish - Post	Fastening Type	Connector Type	Contact Shape	Number of Positions	Contact Finish - Mating	Operating Temperature (Max)	Operating Temperature (Min)	Current Rating	Number of Positions Loaded	Pitch - Mating	Contact Finish Thickness - Mating	Style	Shrouding	Material Flammability Rating	Row Spacing - Mating	Mounting Type	Contact Length - Mating	Contact Material	Termination	Contact Type	Contact Length - Post	Overall Contact Length	Contact Finish Thickness - Post
Samtec Inc. HMTSW-115-12-S-D-730-RA	Natural	Liquid Crystal Polymer (LCP)	0.24 in	2	Tin	Push-Pull	Header	Square	30	Gold	125 °C	-55 °C	3 A	All	0.1 in	30 µin	Board Board or Cable	Unshrouded	UL94 V-0	0.1 in	Right Angle Through Hole	0.73 in	Phosphor Bronze	Solder	Male Pin
Samtec Inc. HMTSW-115-09-S-S-540	Natural	Liquid Crystal Polymer (LCP)	0.1 in	1	Tin	Push-Pull	Header	Square	15	Gold	125 °C	-55 °C	3 A	All	0.1 in	30 µin	Board Board or Cable	Unshrouded	UL94 V-0		Through Hole	0.54 in	Phosphor Bronze	Solder	Male Pin	0.09 in	0.73 in
Samtec Inc. HMTSW-115-24-G-S-290	Natural	Liquid Crystal Polymer (LCP)	0.1 in	1	Gold	Push-Pull	Header	Square	15	Gold	125 °C	-55 °C	3 A	All	0.1 in	10 µin	Board Board or Cable	Unshrouded	UL94 V-0		Through Hole	0.29 in	Phosphor Bronze	Solder	Male Pin	0.09 in	0.48 in	3 µin
Samtec Inc. HMTSW-115-07-T-S-130-RA	Natural	Liquid Crystal Polymer (LCP)	0.122 in	1	Tin	Push-Pull	Header	Square	15	Tin	105 °C	-55 °C	3 A	All	0.1 in		Board Board or Cable	Unshrouded	UL94 V-0		Right Angle Through Hole	0.13 in	Phosphor Bronze	Solder	Male Pin
Samtec Inc. HMTSW-115-24-S-D-285	Natural	Liquid Crystal Polymer (LCP)	0.1 in	2	Tin	Push-Pull	Header	Square	30	Gold	125 °C	-55 °C	3 A	All	0.1 in	30 µin	Board Board or Cable	Unshrouded	UL94 V-0	0.1 in	Through Hole	0.285 in	Phosphor Bronze	Solder	Male Pin	0.095 in	0.48 in
Samtec Inc. HMTSW-115-24-T-D-266	Natural	Liquid Crystal Polymer (LCP)	0.1 in	2	Tin	Push-Pull	Header	Square	30	Tin	105 °C	-55 °C	3 A	All	0.1 in		Board Board or Cable	Unshrouded	UL94 V-0	0.1 in	Through Hole	0.266 in	Phosphor Bronze	Solder	Male Pin	0.114 in	0.48 in
Samtec Inc. HMTSW-115-23-SM-D-225	Natural	Liquid Crystal Polymer (LCP)	0.1 in	2	Tin	Push-Pull	Header	Square	30	Gold	125 °C	-55 °C	3 A	All	0.1 in	30 µin	Board Board or Cable	Unshrouded	UL94 V-0	0.1 in	Through Hole	0.225 in	Phosphor Bronze	Solder	Male Pin	0.12 in	0.445 in
Samtec Inc. HMTSW-115-22-L-D-430	Natural	Liquid Crystal Polymer (LCP)	0.1 in	2	Tin	Push-Pull	Header	Square	30	Gold	125 °C	-55 °C	3 A	All	0.1 in	10 µin	Board Board or Cable	Unshrouded	UL94 V-0	0.1 in	Through Hole	0.43 in	Phosphor Bronze	Solder	Male Pin	0.1 in	0.63 in
Samtec Inc. HMTSW-115-22-G-D-400	Natural	Liquid Crystal Polymer (LCP)	0.1 in	2	Gold	Push-Pull	Header	Square	30	Gold	125 °C	-55 °C	3 A	All	0.1 in	10 µin	Board Board or Cable	Unshrouded	UL94 V-0	0.1 in	Through Hole	0.4 in	Phosphor Bronze	Solder	Male Pin	0.13 in	0.63 in	3 µin
Samtec Inc. HMTSW-115-09-T-D-540	Natural	Liquid Crystal Polymer (LCP)	0.1 in	2	Tin	Push-Pull	Header	Square	30	Tin	105 °C	-55 °C	3 A	All	0.1 in		Board Board or Cable	Unshrouded	UL94 V-0	0.1 in	Through Hole	0.54 in	Phosphor Bronze	Solder	Male Pin	0.09 in	0.73 in