FTR-113 Series
Manufacturer: Samtec Inc.
CONN HEADER SMD 26POS 1.27MM
| Part | Number of Rows | Row Spacing - Mating | Insulation Material | Connector Type | Number of Positions Loaded | Shrouding | Contact Finish - Post | Contact Finish - Mating | Insulation Height | Material Flammability Rating | Features | Termination | Number of Positions | Contact Length - Mating | Style | Fastening Type | Mounting Type | Current Rating (Per Contact) | Contact Type | Contact Finish Thickness - Mating | Operating Temperature (Max) | Operating Temperature (Min) | Contact Material | Pitch - Mating | Contact Shape | Insulation Color | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 2 | 0.1 in | Liquid Crystal Polymer (LCP) | Header | All | Unshrouded | Tin | Gold | 0.1 in | UL94 V-0 | Pick and Place | Solder | 26 | 0.205 in | Board | Push-Pull | Surface Mount | 3.1 A | Male Pin | 30 µin | 125 °C | -55 °C | Phosphor Bronze | 0.05 in | Square | Black | |
Samtec Inc. | 2 | 0.1 in | Liquid Crystal Polymer (LCP) | Header | All | Unshrouded | Tin | Gold | 0.1 in | UL94 V-0 | Solder | 26 | 0.125 in | Board | Push-Pull | Surface Mount | 3.1 A | Male Pin | 30 µin | 125 °C | -55 °C | Phosphor Bronze | 0.05 in | Square | Black | ||
Samtec Inc. | 2 | 0.1 in | Liquid Crystal Polymer (LCP) | Header | All | Unshrouded | Tin | Gold | 0.1 in | UL94 V-0 | Board Guide | Solder | 26 | 0.335 in | Board | Push-Pull | Surface Mount | 3.1 A | Male Pin | 30 µin | 125 °C | -55 °C | Phosphor Bronze | 0.05 in | Square | Black | |
Samtec Inc. | 2 | 0.1 in | Liquid Crystal Polymer (LCP) | Header | All | Unshrouded | Tin | Gold | 0.1 in | UL94 V-0 | Pick and Place | Solder | 26 | 0.23 in | Board | Push-Pull | Surface Mount | 3.1 A | Male Pin | 30 µin | 125 °C | -55 °C | Phosphor Bronze | 0.05 in | Square | Black | |
Samtec Inc. | 2 | 0.1 in | Liquid Crystal Polymer (LCP) | Header | All | Unshrouded | Tin | Gold | 0.1 in | UL94 V-0 | Solder | 26 | 0.125 in | Board | Push-Pull | Surface Mount | 3.1 A | Male Pin | 10 µin | 125 °C | -55 °C | Phosphor Bronze | 0.05 in | Square | Black | ||
Samtec Inc. | 2 | 0.1 in | Liquid Crystal Polymer (LCP) | Header | All | Unshrouded | Tin | Gold | 0.1 in | UL94 V-0 | Board Guide | Solder | 26 | 0.285 in | Board | Push-Pull | Surface Mount | 3.1 A | Male Pin | 30 µin | 125 °C | -55 °C | Phosphor Bronze | 0.05 in | Square | Black | |
Samtec Inc. | 2 | 0.1 in | Liquid Crystal Polymer (LCP) | Header | All | Unshrouded | Gold | Gold | 0.1 in | UL94 V-0 | Board Guide | Solder | 26 | 0.405 in | Board | Push-Pull | Surface Mount | 3.1 A | Male Pin | 10 µin | 125 °C | -55 °C | Phosphor Bronze | 0.05 in | Square | Black | 3 µin |
Samtec Inc. | 2 | 0.1 in | Liquid Crystal Polymer (LCP) | Header | All | Unshrouded | Tin | Gold | 0.1 in | UL94 V-0 | Solder | 26 | 0.43 in | Board | Push-Pull | Surface Mount | 3.1 A | Male Pin | 30 µin | 125 °C | -55 °C | Phosphor Bronze | 0.05 in | Square | Black | ||
Samtec Inc. | 2 | 0.1 in | Liquid Crystal Polymer (LCP) | Header | All | Unshrouded | Tin | Gold | 0.1 in | UL94 V-0 | Solder | 26 | 0.1 in | Board | Push-Pull | Surface Mount | 3.1 A | Male Pin | 10 µin | 125 °C | -55 °C | Phosphor Bronze | 0.05 in | Square | Black | ||
Samtec Inc. | 1 | Liquid Crystal Polymer (LCP) | Header | All | Unshrouded | Gold | Gold | 0.1 in | UL94 V-0 | Solder | 13 | 0.1 in | Board | Push-Pull | Surface Mount | 3.1 A | Male Pin | 10 µin | 125 °C | -55 °C | Phosphor Bronze | 0.05 in | Square | Black | 3 µin |