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CONN IC DIP SOCKET 24POS GOLD
| Part | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Mounting Type | Operating Temperature [Max] | Operating Temperature [Min] | Contact Material - Post [custom] | Type | Type | Type | Features | Housing Material | Pitch - Mating | Pitch - Mating | Current Rating (Amps) | Number of Positions or Pins (Grid) | Termination Post Length | Termination Post Length | Material Flammability Rating | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Pitch - Post | Pitch - Post | Termination |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Beryllium Copper | 10 çin | 0.25 çm | Through Hole | 105 ░C | -55 °C | Brass | DIP | 0.6 in | 15.24 mm | Closed Frame Elevated | Glass Filled Nylon 4/6 Polyamide (PA46) | 0.1 in | 2.54 mm | 3 A | 24 | 3.56 mm | 0.14 in | UL94 V-0 | Gold | 30 Áin | 0.76 Ám | Gold | 2.54 mm | 0.1 in | Solder |