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CONN IC DIP SOCKET ZIF 24POS GLD
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Features | Pitch - Post | Pitch - Post | Type | Type | Type | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Termination | Housing Material | Material Flammability Rating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post | Contact Material - Mating | Number of Positions or Pins (Grid) | Current Rating (Amps) | Termination Post Length | Termination Post Length | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 10 çin | 0.25 çm | Through Hole | Closed Frame | 2.54 mm | 0.1 in | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Gold | 0.1 in | 2.54 mm | Solder | Polyphenylene Sulfide (PPS) Glass Filled | UL94 V-0 | 10 çin | 0.25 çm | Gold | Beryllium Copper | 24 | 1 A | 0.11 in | 2.78 mm | Beryllium Copper |
Aries Electronics | 200 µin | 5.08 µm | Through Hole | Closed Frame | 2.54 mm | 0.1 in | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | 0.1 in | 2.54 mm | Solder | Polyphenylene Sulfide (PPS) Glass Filled | UL94 V-0 | 200 µin | 5.08 µm | Tin | Beryllium Copper | 24 | 1 A | 0.11 in | 2.78 mm | Beryllium Copper | |
Aries Electronics | 50 µin | 1.27 µm | Through Hole | Closed Frame | 2.54 mm | 0.1 in | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | Nickel Boron | 0.1 in | 2.54 mm | Solder | Polyphenylene Sulfide (PPS) Glass Filled | UL94 V-0 | 50 µin | 1.27 µm | Nickel Boron | Beryllium Nickel | 24 | 1 A | 0.11 in | 2.78 mm | Beryllium Nickel |