24-6572 Series

Catalog

CONN IC DIP SOCKET ZIF 24POS GLD

Part	Material Flammability Rating	Current Rating	Termination Post Length	Features	Mounting Type	Pitch - Mating	Contact Finish - Mating	Termination	Contact Material - Mating	Contact Material - Post	Pitch - Post	Contact Finish - Post	Row Spacing	Type	Contact Finish Thickness - Post	Housing Material	Contact Finish Thickness - Mating	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns
Aries Electronics 24-6572-11	UL94 V-0	1 A	0.11 in	Closed Frame	Through Hole	0.1 in	Gold	Solder	Beryllium Copper	Beryllium Copper	0.1 in	Gold	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	10 µin	Glass Filled Polyphenylene Sulfide PPS	10 µin	2	24	12
Aries Electronics 24-6572-10	UL94 V-0	1 A	0.11 in	Closed Frame	Through Hole	0.1 in	Tin	Solder	Beryllium Copper	Beryllium Copper	0.1 in	Tin	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	200 µin	Glass Filled Polyphenylene Sulfide PPS	200 Ąin	2	24	12
Aries Electronics 24-6572-16	UL94 V-0	1 A	0.11 in	Closed Frame	Through Hole	0.1 in	Boron Nickel	Solder	Beryllium Nickel	Beryllium Nickel	0.1 in	Nickel Boron	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	50 µin	Glass Filled Polyphenylene Sulfide PPS	50 µin	2	24	12