R8A774 Series
Manufacturer: Renesas Electronics Corporation
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IC MPU RZ/G2E 1.2GHZ 552FBGA
| Part | Core Processor | Bus Width | Number of Cores | Package Name | Package Length | Package Width | Mounting Type | Display & Interface Controllers | RAM Controllers | USB 2.0 Count | USB | USB 3.0 Count | Ethernet Speed Options | Ethernet Ports (10/100Mbps) | Speed | Graphics Acceleration | Co-Processors/DSP | Additional Interfaces | Operating Temperature (Max) | Operating Temperature (Min) | Package / Case | Voltage - I/O (Option 3) | Voltage - I/O (Option 2) | Voltage - I/O (Option 1) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Renesas Electronics Corporation | ARM® Cortex®-A53 | 64 Bit | 2 Core | 552-FBGA | 21 mm | 21 mm | Surface Mount | MIPI-CSI | DDR3L | 1 count | USB 2.0 USB 3.0 | 1 count | 10/100Mbps 100/1000Mbps | 1 | 1.2 GHz | No | Multimedia NEON™ MPE | CAN I2C MMC/SD/SDIO SCI SCI FIFO SPDIF SPI SSI | 85 °C | -40 °C | 552-FBGA | |||
 Renesas Electronics Corporation | ARM® Cortex®-A57 | 64 Bit | 2 Core | 1022-FCBGA 1022-FPBGA | 29 mm | 29 mm | Surface Mount | DU | LPDDR4 | USB (2) | 10/100Mbps 100/1000Mbps | 1 | 1.5 GHz | No | CAN I2C SCI SPI | 85 °C | -40 °C | 1022-BFBGA 1022-BGA FCBGA | 3.3 V | 1.8 V | 0.82 V | |||
Renesas Electronics Corporation | ARM® Cortex®-A53 ARM® Cortex®-A57 | 64 Bit | 6 Core | 1022-FPBGA | 29 mm | 29 mm | Surface Mount | DU | LPDDR4 | USB (2) | 10/100Mbps 100/1000Mbps | 1 | 1.2 GHz 1.5 GHz | No | CAN I2C SCI SPI | 85 °C | -40 °C | 1022-BGA | 3.3 V | 1.8 V | 0.82 V |