ESD-114 Series

Catalog

CONN SOCKET 28POS 0.1 GOLD PCB

Part	Contact Type	Material Flammability Rating	Insulation Color	Insulation Height	Number of Positions	Fastening Type	Contact Finish - Mating	Pitch - Mating	Contact Length - Post	Row Spacing - Mating	Number of Positions Loaded	Mounting Type	Connector Type	Style	Operating Temperature (Max)	Operating Temperature (Min)	Termination	Number of Rows	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Material	Contact Shape	Insulation Material	Contact Finish Thickness - Post
Samtec Inc. ESD-114-T-24	Female Socket	UL94 V-0	Black	0.4 in	28	Push-Pull	Gold	0.1 in	0.115 in	0.1 in	All	Through Hole	Elevated Socket	Board	125 °C	-55 °C	Solder	2	Tin	10 µin	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)
Samtec Inc. ESD-114-G-23	Female Socket	UL94 V-0	Black	0.3 in	28	Push-Pull	Gold	0.1 in	0.115 in	0.1 in	All	Through Hole	Elevated Socket	Board	125 °C	-55 °C	Solder	2	Gold	10 µin	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)	10 µin
Samtec Inc. ESD-114-TT-03	Female Socket	UL94 V-0	Black	0.3 in	28	Push-Pull	Tin	0.1 in	0.153 in	0.1 in	All	Through Hole	Elevated Socket	Board	125 °C	-55 °C	Solder	2	Tin		Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)
Samtec Inc. ESD-114-T-03	Female Socket	UL94 V-0	Black	0.3 in	28	Push-Pull	Gold	0.1 in	0.153 in	0.1 in	All	Through Hole	Elevated Socket	Board	125 °C	-55 °C	Solder	2	Tin	10 µin	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)
Samtec Inc. ESD-114-G-06	Female Socket	UL94 V-0	Black	0.3 in	28	Push-Pull	Gold	0.1 in	0.215 in	0.1 in	All	Through Hole	Elevated Socket	Board	125 °C	-55 °C	Solder	2	Gold	10 µin	Beryllium Copper	Circular	Liquid Crystal Polymer (LCP)	10 µin