12-1518 Series

Catalog

CONN IC DIP SOCKET 12POS GOLD

Part	Current Rating	Material Flammability Rating	Termination Post Length	Row Spacing	Type	Pitch - Mating	Contact Finish - Post	Contact Material - Post	Pitch - Post	Termination	Contact Finish Thickness - Mating	Features	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns	Contact Finish - Mating	Mounting Type	Housing Material	Contact Material - Mating	Contact Finish Thickness - Post
Aries Electronics 12-1518-10H	3 A	UL94 V-0	0.125 in	0.2 in	0.2" (5.08mm) Row Spacing DIP	0.1 in	Tin	Brass	0.1 in	Solder	10 µin	Open Frame	2	12 count	6 count	Gold	Through Hole	Glass Filled Nylon 4/6 PA46 Polyamide	Beryllium Copper	200 µin
Aries Electronics 12-1518-10T	3 A	UL94 V-0	0.125 in	0.2 in	0.2" (5.08mm) Row Spacing DIP	0.1 in	Tin	Brass	0.1 in	Solder	10 µin	Open Frame	2	12 count	6 count	Gold	Through Hole	Glass Filled Nylon 4/6 PA46 Polyamide	Beryllium Copper	200 µin
Aries Electronics 12-1518-00	3 A	UL94 V-0	0.125 in	0.2 in	0.2" (5.08mm) Row Spacing DIP	0.1 in	Tin	Brass	0.1 in	Solder	10 µin	Open Frame	2	12 count	6 count	Gold	Surface Mount	Glass Filled Nylon 4/6 PA46 Polyamide	Beryllium Copper	200 µin