ESQT-130 Series

Catalog

CONN SOCKET 60POS 0.079 GOLD PCB

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Part	Contact Type	Number of Positions Loaded	Insulation Height [custom]	Insulation Height [custom]	Insulation Color	Fastening Type	Number of Positions	Row Spacing - Mating	Row Spacing - Mating	Contact Finish - Post	Mounting Type	Material Flammability Rating	Termination	Contact Length - Post	Contact Length - Post	Contact Shape	Number of Rows	Current Rating (Amps)	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Mating [x]	Pitch - Mating [x]	Contact Material	Connector Type	Style	Insulation Material	Contact Finish - Mating	Contact Length - Post [x]	Contact Length - Post [x]	Insulation Height [z]	Insulation Height [z]	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Insulation Height	Insulation Height
Samtec Inc. ESQT-130-02-L-D-420	Forked	All	0.42 in	10.67 mm	Black	Push-Pull	60	0.079 in	2 mm	Tin	Through Hole	UL94 V-0	Solder	0.43 in	10.92 mm	Square	2	4.5 A	-55 °C	125 °C	10 çin	0.25 çm	0.079 in	2 mm	Phosphor Bronze	Elevated Socket	Board to Board Cable	Liquid Crystal Polymer (LCP)	Gold
Samtec Inc. ESQT-130-02-L-Q-515	Forked	All			Black	Push-Pull	120	0.079 in	2 mm	Tin	Through Hole	UL94 V-0	Solder			Square		4.5 A	-55 °C	125 °C	10 çin	0.25 çm	0.079 in	2 mm	Phosphor Bronze	Elevated Socket	Board to Board Cable	Liquid Crystal Polymer (LCP)	Gold	8.5 mm	0.335 in	0.515 "	13.08 mm
Samtec Inc. ESQT-130-03-G-Q-386	Forked	All			Black	Push-Pull	120	0.079 in	2 mm	Gold	Through Hole	UL94 V-0	Solder			Square		4.5 A	-55 °C	125 °C	20 µin	0.51 µm	0.079 in	2 mm	Phosphor Bronze	Elevated Socket	Board to Board Cable	Liquid Crystal Polymer (LCP)	Gold	1.83 mm	0.072 in			3 µin	0.076 µm	9.8 mm	0.386 in
Samtec Inc. ESQT-130-03-G-D-312	Forked	All			Black	Push-Pull	60	0.079 in	2 mm	Gold	Through Hole	UL94 V-0	Solder	0.146 in	3.7 mm	Square	2	4.5 A	-55 °C	125 °C	20 µin	0.51 µm	0.079 in	2 mm	Phosphor Bronze	Elevated Socket	Board to Board Cable	Liquid Crystal Polymer (LCP)	Gold					3 µin	0.076 µm	7.92 mm	0.312 in
Samtec Inc. ESQT-130-02-L-D-310	Forked	All			Black	Push-Pull	60	0.079 in	2 mm	Tin	Through Hole	UL94 V-0	Solder	0.54 in	13.72 mm	Square	2	4.5 A	-55 °C	125 °C	10 çin	0.25 çm	0.079 in	2 mm	Phosphor Bronze	Elevated Socket	Board to Board Cable	Liquid Crystal Polymer (LCP)	Gold							7.87 mm	0.31 in
Samtec Inc. ESQT-130-03-G-Q-345	Forked	All			Black	Push-Pull	120	0.079 in	2 mm	Gold	Through Hole	UL94 V-0	Solder	0.113 in	2.87 mm	Square		4.5 A	-55 °C	125 °C	20 µin	0.51 µm	0.079 in	2 mm	Phosphor Bronze	Elevated Socket	Board to Board Cable	Liquid Crystal Polymer (LCP)	Gold			0.345 "	8.76 mm	3 µin	0.076 µm
Samtec Inc. ESQT-130-02-M-D-425	Forked	All			Black	Push-Pull	60	0.079 in	2 mm	Tin	Through Hole	UL94 V-0	Solder	0.425 in	10.8 mm	Square	2	4.5 A	-55 °C	125 °C	20 µin	0.51 µm	0.079 in	2 mm	Phosphor Bronze	Elevated Socket	Board to Board Cable	Liquid Crystal Polymer (LCP)	Gold							10.8 mm	0.425 in
Samtec Inc. ESQT-130-03-G-Q-400	Forked	All			Black	Push-Pull	120	0.079 in	2 mm	Gold	Through Hole	UL94 V-0	Solder	0.058 "	1.47 mm	Square		4.5 A	-55 °C	125 °C	20 µin	0.51 µm	0.079 in	2 mm	Phosphor Bronze	Elevated Socket	Board to Board Cable	Liquid Crystal Polymer (LCP)	Gold					3 µin	0.076 µm	10.16 mm	0.4 in
Samtec Inc. ESQT-130-02-MM-Q-600	Forked	All			Black	Push-Pull	120	0.079 in	2 mm	Tin	Through Hole	UL94 V-0	Solder	0.25 in	6.35 mm	Square		4.5 A	-55 °C	125 °C	20 µin	0.51 µm	0.079 in	2 mm	Phosphor Bronze	Elevated Socket	Board to Board Cable	Liquid Crystal Polymer (LCP)	Gold							15.24 mm	0.6 in
Samtec Inc. ESQT-130-02-L-Q-707	Forked	All			Black	Push-Pull	120	0.079 in	2 mm	Tin	Through Hole	UL94 V-0	Solder			Square		4.5 A	-55 °C	125 °C	10 çin	0.25 çm	0.079 in	2 mm	Phosphor Bronze	Elevated Socket	Board to Board Cable	Liquid Crystal Polymer (LCP)	Gold	3.63 mm	0.143 in					17.96 mm	0.707 in