CONN IC DIP SOCKET ZIF 48POS
| Part | Termination Post Length | Termination Post Length | Housing Material | Contact Material - Mating | Contact Material - Post | Termination | Contact Finish - Post | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Features | Pitch - Post | Pitch - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Current Rating (Amps) | Type | Type | Type | Number of Positions or Pins (Grid) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Material Flammability Rating | Operating Temperature [Min] | Operating Temperature [Max] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics 48-3553-16 | 0.11 in | 2.78 mm | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper | Beryllium Copper | Solder | Nickel Boron | Nickel Boron | 0.1 in | 2.54 mm | Closed Frame | 2.54 mm | 0.1 in | 1.27 µm | 50 µin | 1 A | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | 48 | 1.27 µm | 50 µin | Through Hole | UL94 V-0 | ||
Aries Electronics 48-3553-18 | 0.11 in | 2.78 mm | Polyetheretherketone (PEEK), Glass Filled | Beryllium Nickel | Beryllium Nickel | Solder | Nickel Boron | Nickel Boron | 0.1 in | 2.54 mm | Closed Frame | 2.54 mm | 0.1 in | 1.27 µm | 50 µin | 1 A | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | 48 | 1.27 µm | 50 µin | Through Hole | UL94 V-0 | -55 °C | 250 °C |
Aries Electronics 48-3553-10 | 0.11 in | 2.78 mm | Polyphenylene Sulfide (PPS), Glass Filled | Beryllium Copper | Beryllium Copper | Solder | Tin | 0.1 in | 2.54 mm | Closed Frame | 2.54 mm | 0.1 in | 5.08 µm | 200 µin | 1 A | 7.62 mm | 0.3 in | DIP, ZIF (ZIP) | 48 | 5.08 µm | 200 µin | Through Hole | UL94 V-0 |