48-3553 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET ZIF 48POS TIN
| Part | Current Rating | Termination Post Length | Material Flammability Rating | Features | Contact Material - Mating | Mounting Type | Contact Finish - Mating | Contact Finish Thickness - Mating | Row Spacing | Type | Number of Positions or Pins (Grid) | Grid Columns | Grid Rows | Termination | Contact Finish Thickness - Post | Contact Material - Post | Housing Material | Pitch - Mating | Pitch - Post | Contact Finish - Post | Operating Temperature (Max) | Operating Temperature (Min) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | 1 A | 0.11 in | UL94 V-0 | Closed Frame | Beryllium Copper | Through Hole | Tin | 200 Ąin | 0.3 in | 0.3" (7.62mm) Row Spacing DIP ZIF (ZIP) | 48 | 24 | 2 | Solder | 200 µin | Beryllium Copper | Glass Filled Polyphenylene Sulfide PPS | 0.1 in | 0.1 in | Tin | ||
Aries Electronics | 1 A | 0.11 in | UL94 V-0 | Closed Frame | Beryllium Nickel | Through Hole | Boron Nickel | 50 µin | 0.3 in | 0.3" (7.62mm) Row Spacing DIP ZIF (ZIP) | 48 | 24 | 2 | Solder | 50 µin | Beryllium Nickel | Glass Filled PEEK Polyetheretherketone | 0.1 in | 0.1 in | Nickel Boron | 250 °C | -55 °C |