Beta
⌘K
8P SIP GOLD BERYLLIUM COPPER ALLOY 2.54MM PLUGIN IC / TRANSISTOR SOCKET ROHS
| Part | Contact Finish - Mating | Contact Material - Post [custom] | Mounting Type | Termination | Housing Material | Pitch - Post | Pitch - Post | Termination Post Length | Termination Post Length | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Material Flammability Rating | Type | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) | Current Rating (Amps) | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Gold | Brass | Through Hole | Solder | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | 3.18 mm | 0.125 in | Beryllium Copper | 10 çin | 0.25 çm | 10 çin | 0.25 çm | Open Frame | UL94 V-0 | SIP | 0.1 in | 2.54 mm | 8 | 3 A | Gold |
Aries Electronics | Gold | Brass | Through Hole | Solder | Glass Filled Nylon 4/6 Polyamide (PA46) | 2.54 mm | 0.1 in | 3.18 mm | 0.125 in | Beryllium Copper | 200 µin | 5.08 µm | 10 çin | 0.25 çm | Open Frame | UL94 V-0 | SIP | 0.1 in | 2.54 mm | 8 | 3 A | Tin |