18-8400 Series

Catalog

CONN IC DIP SOCKET 18POS GOLD

Part	Mounting Type	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Contact Finish - Post	Termination	Features	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post	Termination Post Length	Termination Post Length	Pitch - Mating	Pitch - Mating	Type	Type	Type	Current Rating (Amps)	Number of Positions or Pins (Grid)	Operating Temperature [Max]	Operating Temperature [Min]	Contact Finish - Mating	Contact Material - Post [custom]	Housing Material
Aries Electronics 18-8400-610C	Through Hole	UL94 V-0	30 Áin	0.76 Ám	Beryllium Copper	Gold	Solder	Closed Frame Elevated	10 çin	0.25 çm	2.54 mm	0.1 in	3.56 mm	0.14 in	0.1 in	2.54 mm	DIP	0.6 in	15.24 mm	3 A	18	105 ░C	-55 °C	Gold	Brass	Glass Filled Nylon 4/6 Polyamide (PA46)
Aries Electronics 18-8400-310C	Through Hole	UL94 V-0	30 Áin	0.76 Ám	Beryllium Copper	Gold	Solder	Closed Frame Elevated	10 çin	0.25 çm	2.54 mm	0.1 in	3.56 mm	0.14 in	0.1 in	2.54 mm	DIP	0.3 "	7.62 mm	3 A	18	105 ░C	-55 °C	Gold	Brass	Glass Filled Nylon 4/6 Polyamide (PA46)