W66CP2 Series
Manufacturer: Winbond Electronics
IC DRAM 4GBIT LVSTL 11 200WFBGA
| Part | Technology | Memory Type | Memory Format | Memory Size | Clock Frequency | Write Cycle Time - Word | Write Cycle Time - Page | Access Time | Package Width | Package Name | Package Length | Operating Temperature (Min) | Operating Temperature (Max) | Package / Case | Memory Width | Memory Depth | Mounting Type | Memory Interface (Type) | Voltage - Supply (Range 2 Maximum) | Voltage - Supply (Range 1 Maximum) | Voltage - Supply (Range 2 Minimum) | Voltage - Supply (Range 1 Minimum) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Winbond Electronics | SDRAM - Mobile LPDDR4 | Volatile | DRAM | 4 Gbit | 2.133 GHz | 18 ns | 18 ns | 3.5 ns | 14.5 mm | 200-WFBGA | 10 mm | -40 °C | 105 °C | 200-WFBGA | 32 bit | 128 M | Surface Mount | LVSTL_11 | 1.95 V | 1.17 V | 1.7 V | 1.06 V |
Winbond Electronics | SDRAM - Mobile LPDDR4 | Volatile | DRAM | 4 Gbit | 2.133 GHz | 18 ns | 18 ns | 3.5 ns | 14.5 mm | 200-WFBGA | 10 mm | -40 °C | 105 °C | 200-WFBGA | 32 bit | 128 M | Surface Mount | LVSTL_11 | 1.95 V | 1.17 V | 1.7 V | 1.06 V |
Winbond Electronics | SDRAM - Mobile LPDDR4 | Volatile | DRAM | 4 Gbit | 2.133 GHz | 18 ns | 18 ns | 3.5 ns | 14.5 mm | 200-WFBGA | 10 mm | -40 °C | 105 °C | 200-WFBGA | 32 bit | 128 M | Surface Mount | LVSTL_11 | 1.95 V | 1.17 V | 1.7 V | 1.06 V |
Winbond Electronics | SDRAM - Mobile LPDDR4 | Volatile | DRAM | 4 Gbit | 2.133 GHz | 18 ns | 18 ns | 3.5 ns | 14.5 mm | 200-WFBGA | 10 mm | -40 °C | 105 °C | 200-WFBGA | 32 bit | 128 M | Surface Mount | LVSTL_11 | 1.95 V | 1.17 V | 1.7 V | 1.06 V |
Winbond Electronics | SDRAM - Mobile LPDDR4 | Volatile | DRAM | 4 Gbit | 2.133 GHz | 3.5 ns | 14.5 mm | 200-WFBGA | 10 mm | -40 °C | 105 °C | 200-WFBGA | 32 bit | 128 M | Surface Mount | LVSTL_11 | 1.95 V | 1.17 V | 1.7 V | 1.06 V |