Beta
⌘K
CONN SOCKET PGA ZIF GOLD
| Part | Operating Temperature [Max] | Operating Temperature [Min] | Contact Material - Mating | Mounting Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Material Flammability Rating | Termination Post Length | Termination Post Length | Contact Material - Post | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Type | Pitch - Post | Pitch - Post | Contact Finish - Mating | Termination | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 125 °C | -65 ░C | Beryllium Copper | Through Hole | 200 µin | 5.08 µm | 1 A | 0.1 in | 2.54 mm | UL94 V-0 | 3.18 mm | 0.125 in | Beryllium Copper | Closed Frame | 30 Áin | 0.76 Ám | PGA ZIF (ZIP) | 2.54 mm | 0.1 in | Gold | Solder | Tin |