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CONN IC DIP SOCKET 28POS GOLD
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Current Rating (Amps) | Operating Temperature [Max] | Operating Temperature [Min] | Type | Type | Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Mounting Type | Material Flammability Rating | Contact Material - Post [custom] | Features | Contact Material - Mating | Housing Material | Termination Post Length | Termination Post Length | Contact Finish - Mating | Pitch - Post | Pitch - Post | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) | Termination | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 10 çin | 0.25 çm | 3 A | 105 ░C | -55 °C | 0.3 " | 7.62 mm | DIP | 200 µin | 5.08 µm | Through Hole | UL94 V-0 | Brass | Closed Frame | Beryllium Copper | Glass Filled Nylon 4/6 Polyamide (PA46) | 3.18 mm | 0.125 in | Gold | 2.54 mm | 0.1 in | 0.1 in | 2.54 mm | 28 | Solder | Tin |