SOLDER FLUX-CORED/331 63/37 .031
| Part | Storage/Refrigeration Temperature [Min] | Storage/Refrigeration Temperature [Max] | Form | Form | Flux Type | Wire Gauge | Melting Point [custom] | Melting Point [custom] | Process | Type | Diameter [diameter] | Diameter [diameter] | Wire Gauge |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Kester Solder | 10 °C | 40 °C | Spool | 17.64 oz 500 g | Water Soluble | 20 AWG 22 SWG | 361 °F | 183 °C | Leaded | Wire Solder | |||
Kester Solder | 10 °C | 40 °C | Spool | 17.64 oz 500 g | No-Clean | 22 AWG 23 SWG | 361 °F | 183 °C | Leaded | Wire Solder | |||
Kester Solder | 10 °C | 40 °C | Spool | 17.64 oz 500 g | No-Clean | 361 °F | 183 °C | Leaded | Wire Solder | 1.02 mm | 0.04 in | 18 AWG 19 SWG | |
Kester Solder | 10 °C | 40 °C | Spool | 17.64 oz 500 g | No-Clean | 22 AWG 23 SWG | 361 °F | 183 °C | Leaded | Wire Solder | |||
Kester Solder | 10 °C | 40 °C | Spool | 17.64 oz 500 g | Rosin Mildly Activated (RMA) | 361 °F | 183 °C | Leaded | Wire Solder | 0.38 mm | 0.015 in | 27 AWG 28 SWG | |
Kester Solder | 10 °C | 40 °C | Spool | 17.64 oz 500 g | No-Clean | 361 °F | 183 °C | Leaded | Wire Solder | 1.19 mm | 0.047 in | 17 AWG 18 SWG | |
Kester Solder | 10 °C | 40 °C | Spool | 17.64 oz 500 g | No-Clean | 20 AWG 22 SWG | 361 °F | 183 °C | Leaded | Wire Solder | |||
Kester Solder | 10 °C | 40 °C | Spool | 17.64 oz 500 g | Rosin Mildly Activated (RMA) | 20 AWG 22 SWG | 361 °F | 183 °C | Leaded | Wire Solder | |||
Kester Solder | 10 °C | 40 °C | Spool | 17.64 oz 500 g | No-Clean | 361 °F | 183 °C | Leaded | Wire Solder | 1.57 mm | 0.062 in | 13.5 AWG 16 SWG | |
Kester Solder | 10 °C | 40 °C | Spool | 17.64 oz 500 g | Water Soluble | 361 °F | 183 °C | Leaded | Wire Solder | 0.51 mm | 0.02 in | 24 AWG 25 mmý |