10-2511 Series

Catalog

CONN IC DIP SOCKET 10POS GOLD

Part	Housing Material	Pitch - Post	Pitch - Post	Termination	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Type	Type	Type	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Material Flammability Rating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Current Rating (Amps)	Features	Termination Post Length	Termination Post Length	Contact Finish - Mating	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish - Post	Contact Material - Post	Mounting Type
Aries Electronics 10-2511-11	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	Solder	0.1 in	2.54 mm	Phosphor Bronze	DIP	5.08 mm	0.2 in	2 x 5	10	10 çin	0.25 çm	UL94 V-0	10 çin	0.25 çm	1 A	Closed Frame	0.15 in	3.81 mm	Gold	-55 °C	125 °C	Gold	Phosphor Bronze	Through Hole
Aries Electronics 10-2511-10	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	Solder	0.1 in	2.54 mm	Phosphor Bronze	DIP	5.08 mm	0.2 in	2 x 5	10	200 µin	5.08 µm	UL94 V-0	200 µin	5.08 µm	1 A	Closed Frame	0.15 in	3.81 mm		-55 °C	105 ░C	Tin	Phosphor Bronze	Through Hole