SP5746 Series
Manufacturer: NXP USA Inc.
DUAL CORE, 3M FLASH, 384K RAM, FLEXRAY, ISO CAN FD, HSM, AUTOMOTIVE QUALIFIED, -40C > 105C, 160MHZ/ REEL ROHS COMPLIANT: YES
| Part | Peripherals | Connectivity | Program Memory Type | A/D Resolution (bits) | A/D Channels | Speed (Min) | Speed (Max) | Speed | Program Memory Width | Program Memory Depth | Program Memory Size | Core Size (Bit Width) | Core Configuration | Package Width | Package Name | Package Length | Number of I/O | RAM Size Width | RAM Size Depth | Package / Case | Core Processor | Oscillator Type | Operating Temperature (Max) | Operating Temperature (Min) | Mounting Type | Voltage - Supply (Vcc/Vdd) Minimum | Voltage - Supply (Vcc/Vdd) Maximum | EEPROM Size (Width) | EEPROM Size (Depth) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP USA Inc. | DMA LVD POR WDT | CANbus Ethernet I2C LINbus SAI SPI USB USB OTG | FLASH | 10 bit 12 bit | 64 count 80 count | 80 MHz | 160 MHz | 80 MHz 160 MHz | 8 bit | 3 M | 3 MB | 32 Bit | Dual-Core | 24 mm | 176-LQFP | 24 mm | 129 | 8 bit | 512 K | 176-LQFP Exposed Pad | e200z2 e200z4 | Internal | 105 °C | -40 °C | Surface Mount | 3 V | 5.5 V | ||
NXP USA Inc. | DMA LVD POR WDT | CANbus Ethernet I2C LINbus SAI SPI USB USB OTG | FLASH | 10 bit 12 bit | 64 count 80 count | 80 MHz | 160 MHz | 80 MHz 160 MHz | 8 bit | 3 M | 3 MB | 32 Bit | Dual-Core | 17 mm | 256-MAPPBGA | 17 mm | 178 | 8 bit | 512 K | 256-LBGA | e200z2 e200z4 | Internal | 125 °C | -40 °C | Surface Mount | 3 V | 5.5 V | ||
NXP USA Inc. | DMA LVD POR WDT | CANbus Ethernet I2C LINbus SAI SPI USB USB OTG | FLASH | 10 bit 12 bit | 64 count 80 count | 80 MHz | 160 MHz | 80 MHz 160 MHz | 8 bit | 3 M | 3 MB | 32 Bit | Dual-Core | 11 mm | 100-MAPBGA | 11 mm | 8 bit | 512 K | 100-LFBGA | e200z2 e200z4 | Internal | 125 °C | -40 °C | Surface Mount | 3 V | 5.5 V | |||
NXP USA Inc. | DMA LVD POR WDT | CANbus Ethernet I2C LINbus SAI SPI USB USB OTG | FLASH | 10 bit 12 bit | 64 count 80 count | 80 MHz | 160 MHz | 80 MHz 160 MHz | 8 bit | 3 M | 3 MB | 32 Bit | Dual-Core | 11 mm | 100-MAPBGA | 11 mm | 8 bit | 512 K | 100-LFBGA | e200z2 e200z4 | Internal | 125 °C | -40 °C | Surface Mount | 3 V | 5.5 V | |||
NXP USA Inc. | DMA LVD POR WDT | CANbus Ethernet I2C LINbus SAI SPI USB USB OTG | FLASH | 10 bit 12 bit | 64 count 80 count | 80 MHz | 160 MHz | 80 MHz 160 MHz | 8 bit | 3 M | 3 MB | 32 Bit | Dual-Core | 11 mm | 100-MAPBGA | 11 mm | 8 bit | 512 K | 100-LFBGA | e200z2 e200z4 | Internal | 125 °C | -40 °C | Surface Mount | 3 V | 5.5 V | |||
NXP USA Inc. | DMA LVD POR WDT | CANbus Ethernet I2C LINbus SAI SPI USB USB OTG | FLASH | 10 bit 12 bit | 64 count 80 count | 80 MHz | 160 MHz | 80 MHz 160 MHz | 8 bit | 3 M | 3 MB | 32 Bit | Dual-Core | 24 mm | 176-LQFP | 24 mm | 129 | 8 bit | 512 K | 176-LQFP Exposed Pad | e200z2 e200z4 | Internal | 105 °C | -40 °C | Surface Mount | 3 V | 5.5 V | ||
NXP USA Inc. | |||||||||||||||||||||||||||||
NXP USA Inc. | DMA LVD POR WDT | CANbus Ethernet I2C LINbus SAI SPI USB USB OTG | FLASH | 10 bit 12 bit | 64 count 80 count | 80 MHz | 160 MHz | 80 MHz 160 MHz | 8 bit | 3 M | 3 MB | 32 Bit | Dual-Core | 17 mm | 256-MAPPBGA | 17 mm | 178 | 8 bit | 512 K | 256-LBGA | e200z2 e200z4 | Internal | 125 °C | -40 °C | Surface Mount | 3 V | 5.5 V | ||
NXP USA Inc. | DMA LVD POR WDT | CANbus Ethernet I2C LINbus SAI SPI USB USB OTG | FLASH | 10 bit 12 bit | 16 count 36 count | 80 MHz 160 MHz | 8 bit | 3 M | 3 MB | 32 Bit | Dual-Core | 24 mm | 176-LQFP | 24 mm | 129 | 8 bit | 384 K | 176-LQFP Exposed Pad | e200z2 e200z4 | Internal | 105 °C | -40 °C | Surface Mount | 3.15 V | 5.5 V | 8 bit | 128 K | ||
NXP USA Inc. | DMA LVD POR WDT | CANbus Ethernet I2C LINbus SAI SPI USB USB OTG | FLASH | 10 bit 12 bit | 64 count 80 count | 80 MHz | 160 MHz | 80 MHz 160 MHz | 8 bit | 3 M | 3 MB | 32 Bit | Dual-Core | 17 mm | 256-MAPPBGA | 17 mm | 178 | 8 bit | 512 K | 256-LBGA | e200z2 e200z4 | Internal | 125 °C | -40 °C | Surface Mount | 3 V | 5.5 V |