FTMH-114 Series
Manufacturer: Samtec Inc.
CONN HEADER SMD 28POS 1MM
| Part | Insulation Height | Connector Type | Number of Positions | Number of Positions Loaded | Shrouding | Insulation Color | Style | Contact Material | Fastening Type | Row Spacing - Mating | Contact Finish - Post | Contact Finish - Mating | Operating Temperature (Max) | Operating Temperature (Min) | Features | Termination | Material Flammability Rating | Mounting Type | Number of Rows | Insulation Material | Contact Length - Mating | Contact Shape | Contact Finish Thickness - Mating | Current Rating (Per Contact) | Pitch - Mating | Contact Type | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.059 in | Header | 28 | All | Unshrouded | Black | Board | Phosphor Bronze | Push-Pull | 0.039 in | Tin | Gold | 125 °C | -55 °C | Pick and Place | Solder | UL94 V-0 | Surface Mount | 2 | Liquid Crystal Polymer (LCP) | 0.065 in | Square | 10 µin | 2.8 A | 0.039 in | Male Pin | |
Samtec Inc. | 0.059 in | Header | 28 | All | Unshrouded | Black | Board | Phosphor Bronze | Push-Pull | 0.039 in | Tin | Gold | 125 °C | -55 °C | Solder | UL94 V-0 | Surface Mount | 2 | Liquid Crystal Polymer (LCP) | 0.075 in | Square | 10 µin | 2.8 A | 0.039 in | Male Pin | ||
Samtec Inc. | 0.059 in | Header | 28 | All | Unshrouded | Black | Board | Phosphor Bronze | Push-Pull | 0.039 in | Tin | Gold | 125 °C | -55 °C | End Shrouds | Solder | UL94 V-0 | Surface Mount | 2 | Liquid Crystal Polymer (LCP) | 0.065 in | Square | 10 µin | 2.8 A | 0.039 in | Male Pin | |
Samtec Inc. | 0.059 in | Header | 28 | All | Unshrouded | Black | Board | Phosphor Bronze | Push-Pull | 0.039 in | Tin | Gold | 125 °C | -55 °C | Solder | UL94 V-0 | Surface Mount | 2 | Liquid Crystal Polymer (LCP) | 0.075 in | Square | 3 µin | 2.8 A | 0.039 in | Male Pin | ||
Samtec Inc. | 0.059 in | Header | 28 | All | Unshrouded | Black | Board | Phosphor Bronze | Push-Pull | 0.039 in | Gold | Gold | 125 °C | -55 °C | Board Guide End Shrouds | Solder | UL94 V-0 | Surface Mount | 2 | Liquid Crystal Polymer (LCP) | 0.075 in | Square | 30 µin | 2.8 A | 0.039 in | Male Pin | 3 µin |
Samtec Inc. | 0.059 in | Header | 28 | All | Unshrouded | Black | Board | Phosphor Bronze | Push-Pull | 0.039 in | Tin | Gold | 125 °C | -55 °C | End Shrouds | Solder | UL94 V-0 | Surface Mount | 2 | Liquid Crystal Polymer (LCP) | 0.065 in | Square | 10 µin | 2.8 A | 0.039 in | Male Pin | |
Samtec Inc. | 0.059 in | Header | 28 | All | Unshrouded | Black | Board | Phosphor Bronze | Push-Pull | 0.039 in | Tin | Gold | 125 °C | -55 °C | Board Guide End Shrouds | Solder | UL94 V-0 | Surface Mount | 2 | Liquid Crystal Polymer (LCP) | 0.075 in | Square | 3 µin | 2.8 A | 0.039 in | Male Pin | |
Samtec Inc. | 0.059 in | Header | 28 | All | Unshrouded | Black | Board | Phosphor Bronze | Push-Pull | 0.039 in | Tin | Gold | 125 °C | -55 °C | Solder | UL94 V-0 | Surface Mount | 2 | Liquid Crystal Polymer (LCP) | 0.075 in | Square | 3 µin | 2.8 A | 0.039 in | Male Pin | ||
Samtec Inc. | 0.059 in | Header | 28 | All | Unshrouded | Black | Board | Phosphor Bronze | Push-Pull | 0.039 in | Tin | Gold | 125 °C | -55 °C | Board Lock End Shrouds Pick and Place | Solder | UL94 V-0 | Surface Mount | 2 | Liquid Crystal Polymer (LCP) | 0.075 in | Square | 10 µin | 2.8 A | 0.039 in | Male Pin | |
Samtec Inc. | 0.059 in | Header | 28 | All | Unshrouded | Black | Board | Phosphor Bronze | Push-Pull | 0.039 in | Tin | Gold | 125 °C | -55 °C | End Shrouds | Solder | UL94 V-0 | Surface Mount | 2 | Liquid Crystal Polymer (LCP) | 0.075 in | Square | 10 µin | 2.8 A | 0.039 in | Male Pin |