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CONN IC DIP SOCKET 30POS GOLD
| Part | Pitch - Post | Pitch - Post | Housing Material | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Mating | Material Flammability Rating | Features | Contact Material - Post [custom] | Pitch - Mating | Pitch - Mating | Termination | Type | Type | Type | Termination Post Length | Termination Post Length | Contact Finish - Mating | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Current Rating (Amps) | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 2.54 mm | 0.1 in | Glass Filled Nylon 4/6 Polyamide (PA46) | 200 µin | 5.08 µm | Beryllium Copper | UL94 V-0 | Closed Frame | Brass | 0.1 in | 2.54 mm | Solder | DIP | 0.6 in | 15.24 mm | 3.56 mm | 0.14 in | Gold | 30 | 2 | 15 | 3 A | 105 ░C | -55 °C | 30 Áin | 0.76 Ám | Tin |