CONN HEADER SMD 23POS 1.27MM
| Part | Contact Material | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Shape | Operating Temperature [Min] | Operating Temperature [Max] | Number of Positions | Number of Positions Loaded | Contact Length - Mating | Contact Length - Mating | Insulation Color | Insulation Material | Connector Type | Contact Finish - Mating | Shrouding | Insulation Height | Insulation Height | Current Rating (Amps) | Mounting Type | Pitch - Mating | Pitch - Mating | Fastening Type | Material Flammability Rating | Contact Type | Termination | Number of Rows | Features | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Contact Length - Mating [x] | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Phosphor Bronze | Tin | 30 Áin | 0.76 Ám | Square | -55 °C | 125 °C | 23 | All | 0.1 in | 2.54 mm | Black | Liquid Crystal Polymer (LCP) | Header | Gold | Unshrouded | 0.1 in | 2.54 mm | 3.1 A | Surface Mount | 0.05 in | 1.27 mm | Push-Pull | UL94 V-0 | Male Pin | Solder | 1 | ||||||
Samtec Inc. | Phosphor Bronze | Tin | 30 Áin | 0.76 Ám | Square | -55 °C | 125 °C | 46 | All | 0.39 in | 9.91 mm | Black | Liquid Crystal Polymer (LCP) | Header | Gold | Unshrouded | 0.1 in | 2.54 mm | 3.1 A | Surface Mount | 0.05 in | 1.27 mm | Push-Pull | UL94 V-0 | Male Pin | Solder | 2 | Pick and Place | 2.54 mm | 0.1 in | |||
Samtec Inc. | Phosphor Bronze | Tin | Square | -55 °C | 125 °C | 46 | All | 5.84 mm | Black | Liquid Crystal Polymer (LCP) | Header | Unshrouded | 0.1 in | 2.54 mm | 3.1 A | Surface Mount | 0.05 in | 1.27 mm | Push-Pull | UL94 V-0 | Male Pin | Solder | 2 | Board Guide | 2.54 mm | 0.1 in | 0.23 in | ||||||
Samtec Inc. | Phosphor Bronze | Tin | 30 Áin | 0.76 Ám | Square | -55 °C | 125 °C | 46 | All | 0.1 in | 2.54 mm | Black | Liquid Crystal Polymer (LCP) | Header | Gold | Unshrouded | 0.1 in | 2.54 mm | 3.1 A | Surface Mount | 0.05 in | 1.27 mm | Push-Pull | UL94 V-0 | Male Pin | Solder | 2 | 2.54 mm | 0.1 in | ||||
Samtec Inc. | Phosphor Bronze | Gold | 10 çin | 0.25 çm | Square | -55 °C | 125 °C | 46 | All | 5.84 mm | Black | Liquid Crystal Polymer (LCP) | Header | Gold | Unshrouded | 0.1 in | 2.54 mm | 3.1 A | Surface Mount | 0.05 in | 1.27 mm | Push-Pull | UL94 V-0 | Male Pin | Solder | 2 | Board Guide | 2.54 mm | 0.1 in | 0.23 in | 3 µin | 0.076 µm | |
Samtec Inc. | Phosphor Bronze | Tin | 30 Áin | 0.76 Ám | Square | -55 °C | 125 °C | 46 | All | 0.1 in | 2.54 mm | Black | Liquid Crystal Polymer (LCP) | Header | Gold | Unshrouded | 0.1 in | 2.54 mm | 3.1 A | Surface Mount | 0.05 in | 1.27 mm | Push-Pull | UL94 V-0 | Male Pin | Solder | 2 | Pick and Place | 2.54 mm | 0.1 in | |||
Samtec Inc. | Phosphor Bronze | Tin | 30 Áin | 0.76 Ám | Square | -55 °C | 125 °C | 46 | All | 5.84 mm | Black | Liquid Crystal Polymer (LCP) | Header | Gold | Unshrouded | 0.1 in | 2.54 mm | 3.1 A | Surface Mount | 0.05 in | 1.27 mm | Push-Pull | UL94 V-0 | Male Pin | Solder | 2 | Pick and Place | 2.54 mm | 0.1 in | 0.23 in | |||
Samtec Inc. | Phosphor Bronze | Tin | 30 Áin | 0.76 Ám | Square | -55 °C | 125 °C | 46 | All | 5.84 mm | Black | Liquid Crystal Polymer (LCP) | Header | Gold | Unshrouded | 0.1 in | 2.54 mm | 3.1 A | Surface Mount | 0.05 in | 1.27 mm | Push-Pull | UL94 V-0 | Male Pin | Solder | 2 | 2.54 mm | 0.1 in | 0.23 in |