SSQ-137 Series

Catalog

CONN RCPT 37POS 0.1 GOLD PCB

Part	Number of Positions Loaded	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Number of Positions	Contact Finish - Post	Voltage Rating	Contact Shape	Termination	Pitch - Mating	Pitch - Mating	Fastening Type	Contact Material	Material Flammability Rating	Connector Type	Insulation Height	Insulation Height	Style	Contact Type	Insulation Material	Operating Temperature [Min]	Operating Temperature [Max]	Mounting Type	Contact Length - Post	Contact Length - Post	Number of Rows	Insulation Color	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Insulation Height [z]	Insulation Height [z]	Row Spacing - Mating [x]	Row Spacing - Mating [x]
Samtec Inc. SSQ-137-01-S-S	All	30 Áin	0.76 Ám	Gold	37	Tin	465 VAC 655 VDC	Square	Solder	0.1 in	2.54 mm	Push-Pull	Phosphor Bronze	UL94 V-0	Receptacle	0.335 "	8.51 mm	Board to Board Cable	Forked	Liquid Crystal Polymer (LCP)	-55 °C	125 °C	Through Hole	0.104 in	2.64 mm	1	Black
Samtec Inc. SSQ-137-02-G-S-RA	All	20 µin	0.51 µm	Gold	37	Gold	465 VAC 655 VDC	Square	Solder	0.1 in	2.54 mm	Push-Pull	Phosphor Bronze	UL94 V-0	Receptacle			Board to Board Cable	Forked	Liquid Crystal Polymer (LCP)	-55 °C	125 °C	Through Hole Right Angle	0.1 in	2.54 mm	1	Black	3 µin	0.076 µm	0.095 in	2.41 mm
Samtec Inc. SSQ-137-02-G-T-RA	All	20 µin	0.51 µm	Gold	111	Gold	465 VAC 655 VDC	Square	Solder	0.1 in	2.54 mm	Push-Pull	Phosphor Bronze	UL94 V-0	Receptacle	0.295 in	7.5 mm	Board to Board Cable	Forked	Liquid Crystal Polymer (LCP)	-55 °C	125 °C	Through Hole Right Angle	0.1 in	2.54 mm	3	Black	3 µin	0.076 µm			2.54 mm	0.1 in
Samtec Inc. SSQ-137-01-G-T	All	20 µin	0.51 µm	Gold	111	Gold	465 VAC 655 VDC	Square	Solder	0.1 in	2.54 mm	Push-Pull	Phosphor Bronze	UL94 V-0	Receptacle	0.335 "	8.51 mm	Board to Board Cable	Forked	Liquid Crystal Polymer (LCP)	-55 °C	125 °C	Through Hole	0.104 in	2.64 mm	3	Black	3 µin	0.076 µm			2.54 mm	0.1 in
Samtec Inc. SSQ-137-01-T-D	All				74	Tin	465 VAC 655 VDC	Square	Solder	0.1 in	2.54 mm	Push-Pull	Phosphor Bronze	UL94 V-0	Receptacle	0.335 "	8.51 mm	Board to Board Cable	Forked	Liquid Crystal Polymer (LCP)	-55 °C	105 ░C	Through Hole	0.104 in	2.64 mm	2	Black					2.54 mm	0.1 in
Samtec Inc. SSQ-137-03-G-S	All	20 µin	0.51 µm	Gold	37	Gold	465 VAC 655 VDC	Square	Solder	0.1 in	2.54 mm	Push-Pull	Phosphor Bronze	UL94 V-0	Receptacle	0.335 "	8.51 mm	Board to Board Cable	Forked	Liquid Crystal Polymer (LCP)	-55 °C	125 °C	Through Hole	0.394 in	10 mm	1	Black	3 µin	0.076 µm
Samtec Inc. SSQ-137-03-S-S	All	30 Áin	0.76 Ám	Gold	37	Tin	465 VAC 655 VDC	Square	Solder	0.1 in	2.54 mm	Push-Pull	Phosphor Bronze	UL94 V-0	Receptacle	0.335 "	8.51 mm	Board to Board Cable	Forked	Liquid Crystal Polymer (LCP)	-55 °C	125 °C	Through Hole	0.394 in	10 mm	1	Black
Samtec Inc. SSQ-137-02-T-S	All				37	Tin	465 VAC 655 VDC	Square	Solder	0.1 in	2.54 mm	Push-Pull	Phosphor Bronze	UL94 V-0	Receptacle	0.335 "	8.51 mm	Board to Board Cable	Forked	Liquid Crystal Polymer (LCP)	-55 °C	105 ░C	Through Hole	0.194 in	4.93 mm	1	Black
Samtec Inc. SSQ-137-22-G-D	All	20 µin	0.51 µm	Gold	74	Gold	465 VAC 655 VDC	Square	Solder	0.1 in	2.54 mm	Push-Pull	Phosphor Bronze	UL94 V-0	Receptacle	0.335 "	8.51 mm	Board to Board Cable	Forked	Liquid Crystal Polymer (LCP)	-55 °C	125 °C	Through Hole	0.194 in	4.93 mm	2	Black	3 µin	0.076 µm			2.54 mm	0.1 in
Samtec Inc. SSQ-137-02-T-D	All				74	Tin	465 VAC 655 VDC	Square	Solder	0.1 in	2.54 mm	Push-Pull	Phosphor Bronze	UL94 V-0	Receptacle	0.335 "	8.51 mm	Board to Board Cable	Forked	Liquid Crystal Polymer (LCP)	-55 °C	105 ░C	Through Hole	0.194 in	4.93 mm	2	Black					2.54 mm	0.1 in