17-0518 Series

Catalog

CONN SOCKET SIP 17POS GOLD

Part	Current Rating (Amps)	Contact Finish - Mating	Pitch - Mating	Pitch - Mating	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Pitch - Post	Pitch - Post	Contact Finish - Post	Type	Housing Material	Contact Material - Post [custom]	Termination	Termination Post Length	Termination Post Length	Mounting Type	Features	Contact Material - Mating	Termination Post Length [x]	Termination Post Length [x]
Aries Electronics 17-0518-11H	3 A	Gold	0.1 in	2.54 mm	UL94 V-0	10 çin	0.25 çm	17	10 çin	0.25 çm	2.54 mm	0.1 in	Gold	SIP	Glass Filled Nylon 4/6 Polyamide (PA46)	Brass	Solder	3.18 mm	0.125 in	Through Hole	Open Frame	Beryllium Copper
Aries Electronics 17-0518-11	3 A	Gold	0.1 in	2.54 mm	UL94 V-0	10 çin	0.25 çm	17	10 çin	0.25 çm	2.54 mm	0.1 in	Gold	SIP	Glass Filled Nylon 4/6 Polyamide (PA46)	Brass	Solder	3.18 mm	0.125 in	Through Hole	Open Frame	Beryllium Copper
Aries Electronics 17-0518-00	3 A	Gold	0.1 in	2.54 mm	UL94 V-0	10 çin	0.25 çm	17	200 µin	5.08 µm	2.54 mm	0.1 in	Tin	SIP	Glass Filled Nylon 4/6 Polyamide (PA46)	Brass	Solder			Surface Mount	Open Frame	Beryllium Copper	0.046 in	1.17 mm
Aries Electronics 17-0518-10H	3 A	Gold	0.1 in	2.54 mm	UL94 V-0	10 çin	0.25 çm	17	200 µin	5.08 µm	2.54 mm	0.1 in	Tin	SIP	Glass Filled Nylon 4/6 Polyamide (PA46)	Brass	Solder	3.18 mm	0.125 in	Through Hole	Open Frame	Beryllium Copper
Aries Electronics 17-0518-10	3 A	Gold	0.1 in	2.54 mm	UL94 V-0	10 çin	0.25 çm	17	200 µin	5.08 µm	2.54 mm	0.1 in	Tin	SIP	Glass Filled Nylon 4/6 Polyamide (PA46)	Brass	Solder	3.18 mm	0.125 in	Through Hole	Open Frame	Beryllium Copper