STMM-114 Series
Manufacturer: Samtec Inc.
CONN HEADER SMD 28POS 2MM
| Part | Mounting Type | Termination | Contact Shape | Current Rating | Pitch - Mating | Features | Contact Finish - Mating | Row Spacing - Mating | Style | Number of Rows | Insulation Material | Operating Temperature (Max) | Operating Temperature (Min) | Contact Type | Insulation Color | Number of Positions Loaded | Contact Length - Mating | Contact Material | Number of Positions | Shrouding | Fastening Type | Connector Type | Contact Finish - Post | Contact Finish Thickness - Mating | Insulation Height | Contact Finish Thickness - Post | Contact Length - Post | Overall Contact Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Surface Mount | Solder | Square | 3 A | 0.079 in | Keying Slot | Gold | 0.079 in | Board Cable/Wire | 2 | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | Male Pin | Black | All | 0.12 in | Phosphor Bronze | 28 | Shrouded - 4 Wall | Push-Pull | Header | Gold | 30 µin | 0.19 in | 3 µin | ||
Samtec Inc. | Surface Mount | Solder | Square | 3 A | 0.079 in | Keying Slot | Gold | 0.079 in | Board Cable/Wire | 2 | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | Male Pin | Black | All | 0.1 in | Phosphor Bronze | 28 | Shrouded - 4 Wall | Push-Pull | Header | Gold | 20 Ąin | 0.19 in | 3 µin | ||
Samtec Inc. | Right Angle Through Hole | Solder | Square | 3 A | 0.079 in | Keying Slot | Gold | 0.079 in | Board Cable/Wire | 2 | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | Male Pin | Black | All | 0.12 in | Phosphor Bronze | 28 | Shrouded - 4 Wall | Push-Pull | Header | Tin | 10 µin | 0.236 in | 0.09 in | ||
Samtec Inc. | Surface Mount | Solder | Square | 3 A | 0.079 in | Keying Slot | Gold | 0.079 in | Board Cable/Wire | 2 | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | Male Pin | Black | All | 0.12 in | Phosphor Bronze | 28 | Shrouded - 4 Wall | Push-Pull | Header | Tin | 30 µin | 0.19 in | |||
Samtec Inc. | Surface Mount | Solder | Square | 3 A | 0.079 in | Keying Slot | Gold | 0.079 in | Board Cable/Wire | 2 | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | Male Pin | Black | All | 0.12 in | Phosphor Bronze | 28 | Shrouded - 4 Wall | Push-Pull | Header | Gold | 20 Ąin | 0.19 in | 3 µin | ||
Samtec Inc. | Through Hole | Solder | Square | 3 A | 0.079 in | Keying Slot | Gold | 0.079 in | Board Cable/Wire | 2 | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | Male Pin | Black | All | 0.12 in | Phosphor Bronze | 28 | Shrouded - 4 Wall | Push-Pull | Header | Tin | 10 µin | 0.19 in | 0.118 in | 0.302 in | |
Samtec Inc. | Through Hole | Solder | Square | 3 A | 0.079 in | Keying Slot | Tin | 0.079 in | Board Cable/Wire | 2 | Liquid Crystal Polymer (LCP) | 105 °C | -55 °C | Male Pin | Black | All | 0.12 in | Phosphor Bronze | 28 | Shrouded - 4 Wall | Push-Pull | Header | Tin | 0.19 in | 0.118 in | 0.302 in | ||
Samtec Inc. | Through Hole | Solder | Square | 3 A | 0.079 in | Keying Slot | Gold | 0.079 in | Board Cable/Wire | 2 | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | Male Pin | Black | All | 0.1 in | Phosphor Bronze | 28 | Shrouded - 4 Wall | Push-Pull | Header | Gold | 20 Ąin | 0.19 in | 3 µin | 0.092 in | 0.255 in |
Samtec Inc. | Surface Mount | Solder | Square | 3 A | 0.079 in | Keying Slot Pick and Place | Gold | 0.079 in | Board Cable/Wire | 2 | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | Male Pin | Black | All | 0.12 in | Phosphor Bronze | 28 | Shrouded - 4 Wall | Push-Pull | Header | Tin | 30 µin | 0.19 in |