209-PGM Series
Manufacturer: Aries Electronics
CONN SOCKET PGA GOLD
| Part | Material Flammability Rating | Current Rating | Termination Post Length | Contact Finish Thickness - Mating | Mounting Type | Contact Material - Mating | Contact Finish - Mating | Contact Material - Post | Termination | Operating Temperature (Min) | Operating Temperature (Max) | Pitch - Post | Type | Contact Finish - Post | Pitch - Mating | Contact Finish Thickness - Post | Housing Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | 3 A | 0.165 in | 10 µin | Through Hole | Beryllium Copper | Gold | Brass | Solder | -55 °C | 105 °C | 0.1 in | PGA | Tin | 0.1 in | 200 µin | Glass Filled Nylon 4/6 PA46 Polyamide |
Aries Electronics | UL94 V-0 | 3 A | 0.165 in | 10 µin | Through Hole | Beryllium Copper | Gold | Brass | Solder | -55 °C | 105 °C | 0.1 in | PGA | Tin | 0.1 in | 200 µin | Glass Filled Nylon 4/6 PA46 Polyamide |
Aries Electronics | UL94 V-0 | 3 A | 0.165 in | 10 µin | Through Hole | Beryllium Copper | Gold | Brass | Solder | -55 °C | 125 °C | 0.1 in | PGA | Gold | 0.1 in | 10 µin | Glass Filled Nylon 4/6 PA46 Polyamide |
Aries Electronics | UL94 V-0 | 3 A | 0.165 in | 10 µin | Through Hole | Beryllium Copper | Gold | Brass | Solder | -55 °C | 125 °C | 0.1 in | PGA | Gold | 0.1 in | 10 µin | Glass Filled Nylon 4/6 PA46 Polyamide |