14-C195 Series

Catalog

CONN IC DIP SOCKET 14POS GOLD

Part	Termination Post Length	Material Flammability Rating	Current Rating	Row Spacing	Type	Pitch - Mating	Number of Positions or Pins (Grid)	Grid Columns	Grid Rows	Contact Finish - Mating	Mounting Type	Pitch - Post	Contact Finish Thickness - Post	Contact Material - Post	Contact Finish - Post	Contact Material - Mating	Features	Housing Material	Contact Finish Thickness - Mating	Operating Temperature (Min)	Operating Temperature (Max)	Termination
Aries Electronics 14-C195-10	0.125 in	UL94 V-0	3 A	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	14	7	2	Gold	Through Hole	0.1 in	200 µin	Brass	Tin	Beryllium Copper	Closed Frame	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	-55 °C	105 °C	Solder
Aries Electronics 14-C195-31	0.04 in	UL94 V-0	3 A	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	14	7	2	Gold	Through Hole	0.1 in	10 µin	Brass	Gold	Beryllium Copper	Closed Frame	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	-55 °C	125 °C	Wire Wrap
Aries Electronics 14-C195-11	0.125 in	UL94 V-0	3 A	0.3 in	0.3" (7.62mm) Row Spacing DIP	0.1 in	14	7	2	Gold	Through Hole	0.1 in	10 µin	Brass	Gold	Beryllium Copper	Closed Frame	Glass Filled Nylon 4/6 PA46 Polyamide	10 µin	-55 °C	125 °C	Solder