14-C195 Series

Catalog

CONN IC DIP SOCKET 14POS GOLD

Part	Pitch - Mating	Pitch - Mating	Contact Material - Mating	Operating Temperature [Max]	Operating Temperature [Min]	Number of Positions or Pins (Grid)	Pitch - Post	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Termination	Type	Type	Type	Material Flammability Rating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Current Rating (Amps)	Contact Material - Post [custom]	Mounting Type	Features	Termination Post Length	Termination Post Length
Aries Electronics 14-C195-30	0.1 in	2.54 mm	Beryllium Copper	105 ░C	-55 °C	14	2.54 mm	0.1 in	Tin	200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	Wire Wrap	0.3 "	7.62 mm	DIP	UL94 V-0	10 çin	0.25 çm	Gold	3 A	Brass	Through Hole	Closed Frame	0.04 in	1.02 mm
Aries Electronics 14-C195-10	0.1 in	2.54 mm	Beryllium Copper	105 ░C	-55 °C	14	2.54 mm	0.1 in	Tin	200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	Solder	0.3 "	7.62 mm	DIP	UL94 V-0	10 çin	0.25 çm	Gold	3 A	Brass	Through Hole	Closed Frame	0.125 in	3.18 mm
Aries Electronics 14-C195-31	0.1 in	2.54 mm	Beryllium Copper	125 °C	-55 °C	14	2.54 mm	0.1 in	Gold	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	Wire Wrap	0.3 "	7.62 mm	DIP	UL94 V-0	10 çin	0.25 çm	Gold	3 A	Brass	Through Hole	Closed Frame	0.04 in	1.02 mm
Aries Electronics 14-C195-11	0.1 in	2.54 mm	Beryllium Copper	125 °C	-55 °C	14	2.54 mm	0.1 in	Gold	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	Solder	0.3 "	7.62 mm	DIP	UL94 V-0	10 çin	0.25 çm	Gold	3 A	Brass	Through Hole	Closed Frame	0.125 in	3.18 mm