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CONN IC DIP SOCKET 28POS GOLD
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Current Rating (Amps) | Number of Positions or Pins (Grid) | Contact Material - Post [custom] | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Type | Type | Type | Termination | Pitch - Post | Pitch - Post | Housing Material | Termination Post Length | Termination Post Length | Contact Material - Mating | Contact Finish - Mating | Material Flammability Rating | Features | Operating Temperature [Max] | Operating Temperature [Min] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 30 Áin | 0.76 Ám | Tin | 3 A | 28 | Brass | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | 0.3 " | 7.62 mm | DIP | Solder | 2.54 mm | 0.1 in | Glass Filled Nylon 4/6 Polyamide (PA46) | 3.56 mm | 0.14 in | Beryllium Copper | Gold | UL94 V-0 | Closed Frame | 105 ░C | -55 °C |