30-6513 Series

Catalog

CONN IC DIP SOCKET 30POS GOLD

Part	Material Flammability Rating	Current Rating	Termination Post Length	Row Spacing	Type	Termination	Contact Finish - Mating	Features	Operating Temperature (Min)	Operating Temperature (Max)	Contact Material - Post	Pitch - Mating	Contact Finish Thickness - Mating	Pitch - Post	Contact Material - Mating	Mounting Type	Contact Finish - Post	Housing Material	Contact Finish Thickness - Post	Grid Rows	Number of Positions or Pins (Grid)	Grid Columns
Aries Electronics 30-6513-10H	UL94 V-0	3 A	0.125 in	0.6 in	0.6" (15.24mm) Row Spacing DIP	Solder	Gold	Closed Frame	-55 °C	105 °C	Brass	0.1 in	10 µin	0.1 in	Beryllium Copper	Through Hole	Tin	Glass Filled Nylon 4/6 PA46 Polyamide	200 µin	2	30	15
Aries Electronics 30-6513-10	UL94 V-0	3 A	0.125 in	0.6 in	0.6" (15.24mm) Row Spacing DIP	Solder	Gold	Closed Frame	-55 °C	105 °C	Brass	0.1 in	10 µin	0.1 in	Beryllium Copper	Through Hole	Tin	Glass Filled Nylon 4/6 PA46 Polyamide	200 µin	2	30	15