Beta
⌘K
CONN IC DIP SOCKET 30POS GOLD
| Part | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Operating Temperature [Max] | Operating Temperature [Min] | Contact Material - Mating | Housing Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Termination | Contact Finish - Post | Features | Termination Post Length | Termination Post Length | Pitch - Post | Pitch - Post | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Mating | Type | Type | Type | Contact Material - Post [custom] | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 30 | 2 | 15 | 105 ░C | -55 °C | Beryllium Copper | Glass Filled Nylon 4/6 Polyamide (PA46) | 10 çin | 0.25 çm | UL94 V-0 | Solder | Tin | Closed Frame | 3.18 mm | 0.125 in | 2.54 mm | 0.1 in | 3 A | 0.1 in | 2.54 mm | 200 µin | 5.08 µm | Gold | DIP | 0.6 in | 15.24 mm | Brass | Through Hole |