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CONN IC DIP SOCKET 24POS GOLD
| Part | Pitch - Mating | Pitch - Mating | Contact Material - Mating | Features | Housing Material | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Current Rating (Amps) | Termination | Contact Finish - Post | Contact Material - Post [custom] | Material Flammability Rating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) | Contact Finish - Mating | Type | Type | Type | Termination Post Length | Termination Post Length | Pitch - Post | Pitch - Post | Mounting Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.1 in | 2.54 mm | Beryllium Copper | Closed Frame Elevated | Glass Filled Nylon 4/6 Polyamide (PA46) | 105 ░C | -55 °C | 30 Áin | 0.76 Ám | 3 A | Solder | Gold | Brass | UL94 V-0 | 10 çin | 0.25 çm | 24 | Gold | 0.3 " | 7.62 mm | DIP | 3.56 mm | 0.14 in | 2.54 mm | 0.1 in | Through Hole |