CONN HEADER SMD 90POS 1MM
| Part | Contact Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Shape | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Number of Rows | Termination | Number of Positions | Fastening Type | Contact Finish - Post | Insulation Color | Row Spacing - Mating | Row Spacing - Mating | Mounting Type | Operating Temperature [Min] | Operating Temperature [Max] | Shrouding | Current Rating (Amps) | Number of Positions Loaded | Contact Type | Connector Type | Insulation Material | Contact Length - Mating [x] | Contact Length - Mating [x] | Insulation Height | Insulation Height | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Phosphor Bronze | 3 µin | 0.076 µm | Square | Gold | 0.039 in | 1 mm | 2 | Solder | 90 | Push-Pull | Tin | Black | 0.039 " | 1 mm | Surface Mount | -55 °C | 125 °C | Unshrouded | 2.8 A per Contact | All | Male Pin | Cuttable Header | Liquid Crystal Polymer (LCP) | 1.9 mm | 0.075 in | 0.038 in | 0.97 mm | |
Samtec Inc. | Phosphor Bronze | 10 çin | 0.25 çm | Square | Gold | 0.039 in | 1 mm | 2 | Solder | 90 | Push-Pull | Tin | Black | 0.039 " | 1 mm | Surface Mount | -55 °C | 125 °C | Unshrouded | 2.8 A per Contact | All | Male Pin | Cuttable Header | Liquid Crystal Polymer (LCP) | 1.9 mm | 0.075 in | 0.038 in | 0.97 mm | |
Samtec Inc. | Phosphor Bronze | 3 µin | 0.076 µm | Square | Gold | 0.039 in | 1 mm | 2 | Solder | 90 | Push-Pull | Tin | Black | 0.039 " | 1 mm | Surface Mount | -55 °C | 125 °C | Unshrouded | 2.8 A per Contact | All | Male Pin | Cuttable Header | Liquid Crystal Polymer (LCP) | 1.9 mm | 0.075 in | 0.038 in | 0.97 mm | End Shrouds |