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CONN IC DIP SOCKET ZIF 36POS GLD
| Part | Material Flammability Rating | Pitch - Post | Pitch - Post | Contact Material - Post | Mounting Type | Pitch - Mating | Pitch - Mating | Type | Type | Type | Current Rating (Amps) | Contact Finish - Mating | Number of Positions or Pins (Grid) | Housing Material | Features | Termination Post Length | Termination Post Length | Termination | Contact Material - Mating | Contact Finish - Post | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | UL94 V-0 | 2.54 mm | 0.1 in | Beryllium Copper | Through Hole | 0.1 in | 2.54 mm | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | 1 A | Gold | 36 | Polyphenylene Sulfide (PPS) Glass Filled | Closed Frame | 0.11 in | 2.78 mm | Solder | Beryllium Copper | Gold | ||||||
Aries Electronics | UL94 V-0 | 2.54 mm | 0.1 in | Beryllium Copper | Through Hole | 0.1 in | 2.54 mm | 15.24 mm | DIP ZIF (ZIP) | 0.6 " | 1 A | 40 | Polyphenylene Sulfide (PPS) Glass Filled | Closed Frame | 0.11 in | 2.78 mm | Solder | Beryllium Copper | Tin | 20 | 2 | 5.08 µm | 200 µin | 200 µin | 5.08 µm |